Datasheet Texas Instruments V62/12605-01XE
| Manufacturer | Texas Instruments |
| Series | OMAPL138B-EP |
| Part Number | V62/12605-01XE |
Enhanced Product Low-Power Applications Processor 361-NFBGA -55 to 125
Datasheets
OMAPL138B-EP C6000 DSP+ARMВ® Processor datasheet
PDF, 1.8 Mb, Revision: C, File published: Apr 12, 2013
Extract from the document
Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
Packaging
| Pin | 361 | 361 | 361 |
| Package Type | GWT | GWT | GWT |
| Industry STD Term | NFBGA | NFBGA | NFBGA |
| JEDEC Code | S-PBGA-N | S-PBGA-N | S-PBGA-N |
| Package QTY | 90 | 90 | 90 |
| Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) |
| Device Marking | GWTMEP | OMAPL138B | 21 |
| Width (mm) | 16 | 16 | 16 |
| Length (mm) | 16 | 16 | 16 |
| Thickness (mm) | .9 | .9 | .9 |
| Pitch (mm) | .8 | .8 | .8 |
| Max Height (mm) | 1.4 | 1.4 | 1.4 |
| Mechanical Data | Download | Download | Download |
Parametrics
| ARM CPU | 1 ARM9 |
| ARM MHz | 345 Max. |
| Applications | Communications and Telecom,Energy,Industrial,Medical |
| DRAM | LPDDR,DDR2 |
| DSP | 1 C674x |
| DSP MHz | 345 Max. |
| Display Options | 1 |
| EMAC | 10/100 |
| I2C | 2 |
| On-Chip L2 Cache | 256 KB (DSP) |
| Operating Systems | Linux,SYS/BIOS |
| Operating Temperature Range | -55 to 125 C |
| Other On-Chip Memory | 128 KB |
| Rating | HiRel Enhanced Product |
| SPI | 2 |
| UART | 3 SCI |
| USB | 2 |
| Video Port | 1 Configurable |
Eco Plan
| RoHS | See ti.com |
Design Kits & Evaluation Modules
- JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU200-U
XDS200 USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Lifecycle Status: Active (Recommended for new designs)
Application Notes
- Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, Revision: B, File published: Aug 13, 2015
- nFBGA Packaging (Rev. B)PDF, 3.1 Mb, Revision: B, File published: Nov 13, 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts. - Processor SDK RTOS Audio Benchmark Starter KitPDF, 530 Kb, File published: Apr 12, 2017
The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, Revision: A, File published: Aug 9, 2015
Model Line
Series: OMAPL138B-EP (2)
- OMAPL138BGWTMEP V62/12605-01XE
Manufacturer's Classification
- Semiconductors > Space & High Reliability > Processor > Digital Signal Processor > C6000 DSP + ARM Processor
Other Names:
V62/1260501XE, V62/12605 01XE
