Datasheet Texas Instruments CY54FCT377T

ManufacturerTexas Instruments
SeriesCY54FCT377T

Octal D-Type Flip-Flops with Enable

Datasheets

8-Bit Registers datasheet
PDF, 675 Kb, Revision: A, File published: Oct 1, 2001
Extract from the document

Prices

Status

5962-9221902M2A5962-9221903M2ACY54FCT377CTLMB
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNo

Packaging

5962-9221902M2A5962-9221903M2ACY54FCT377CTLMB
N123
Pin202020
Package TypeFKFKFK
Industry STD TermLCCCLCCCLCCC
JEDEC CodeS-CQCC-NS-CQCC-NS-CQCC-N
Package QTY111
CarrierTUBETUBETUBE
Width (mm)8.898.898.89
Length (mm)8.898.898.89
Thickness (mm)1.831.831.83
Pitch (mm)1.271.271.27
Max Height (mm)2.032.032.03
Mechanical DataDownloadDownloadDownload
Device Marking9221903M2A

Eco Plan

5962-9221902M2A5962-9221903M2ACY54FCT377CTLMB
RoHSSee ti.comSee ti.comSee ti.com

Application Notes

  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Kb, Revision: A, File published: Feb 6, 2015
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015

Model Line

Manufacturer's Classification

  • Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers