Datasheet Texas Instruments OMAP5910

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Application Notes

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  OMAP5910 NTSC or VGA Output
  PDF, 252 Kb, File published: Jun 1, 2003
  The OMAPв„ў5910 is a true system-on-a-chip device, which consists of an ARM925T microprocessor unit (MPU) and TMS320C55x digital signal processor (DSP) cores. The device has many important peripherals necessary for luelessly interfacing with external devices in multimedia communication systems. One of the ports available is a eneral-purpose, 16-bit parallel bus called EMIFS that is typically
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  Connecting TFT LCD Displays to the OMAP5910
  PDF, 381 Kb, File published: Nov 30, 2003
  The OMAP5910 processor contains an integrated LCD controller. Using internal memory and dedicated DMA channels, this architecture contains a very efficient LCD control interface. This application note describes how to connect two different LCD displays to the OMAP5910. While there are many sizes and types of LCD displays in the industry, this application note focuses on two 240 x 320 color thin fi
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  OMAP5910 Audio System Design
  PDF, 169 Kb, File published: Nov 19, 2003
  The OMAP5910 is a true system-on-a-chip device, which consists of ARM925T MPU and C55x DSP cores. The device has a large set of peripherals that can be utilized to interface with external radio receivers and audio codecs. This document demonstrates a system audio design using the McBSP1 port of the OMAP5910 and an external audio codec running synchronously with the oversampling master clock. This
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  OMAP5910 DSP External Memory Performance
  PDF, 580 Kb, File published: Dec 11, 2002
  The DSP subsystem of the OMAP5910 can access the 192K bytes of OMAP5910 internal RAM and memory external to the OMAP5910 device, in addition to the 80K x 16 bits of DSP RAM and 16K x 16 bits of DSP ROM. The DSP will achieve the highest performance when the internal DSP RAM is used, but some applications will require the use of internal system RAM or external memory. This report analyzes the DSP pe
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  OMAP5910 ARM Program Throughput Analysis
  PDF, 343 Kb, File published: Jan 31, 2003
  The OMAPВ™ device is built upon a dual-core architecture that consists of a TIARM925T MPU and a C55xВ™ DSP device. Both cores have access to internal memory via an internal memory interface (IMIF) as well as external memory via two external memory interfaces, namely the EMIF Slow (EMIFS) and EMIF Fast (EMIFF). This application report focuses on the ARM side of the device and investigates the
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  OMAP5910 Video Encoding and Decoding
  PDF, 113 Kb, File published: Dec 9, 2003
  In general, video encoding and decoding on the OMAP5910 consist of three phases. The first phase is video pre-processing where the data captured needs to be converted to the encoder input format, second phase is doing the actual video encoding and decoding, and third stage is video post-processing where the decoded data is converted to the LCD input format. This document demonstrates the video enc
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  Using Endianess Conversion in the OMAP5910 Device
  PDF, 238 Kb, File published: Apr 1, 2004
  The OMAP5910™ device features a new dual-core architecture from Texas Instruments™ (TI) that is optimized for multimedia applications in a low-power environment. It couples two processors—a TI enhanced TI925T™ general-purpose processor and an ultralow-power TMS320C55x™ (C55x™) DSP—with a rich set of peripherals and powerful interfaces to achieve optimal pe
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  Connecting an 802.11b WLAN Card to the OMAP5910
  PDF, 135 Kb, File published: Dec 8, 2003
  There are numerous applications that require the addition of an 802.11B WLAN to the OMAP5910. While the OMAP5910 does not easily support a PCARD or compact flash interface, the TI based WLAN card does have a mode that works very well for interconnection to the OMAP5910. This application note describes how, by using this mode, the TI-based 802.11 WLAN card can be connected to the OMAP5910 processor
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  OMAP5910 ARM Data Throughput Analysis
  PDF, 492 Kb, File published: Jan 31, 2003
  This application report describes techniques for measuring throughput and latency of OMAPВ™ TIARM925T data accesses through the on-chip traffic controller. Complete examples are given using external memories such as SDRAM and SRAM for reads, writes and back-to-back, read-write sequences.
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  OMAP5910 Decoupling/Filtering Techniques
  PDF, 124 Kb, File published: Apr 21, 2003
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  Connecting Bluetooth to the OMAP5910
  PDF, 118 Kb, File published: Dec 12, 2003
  There are numerous applications that require the addition of a Bluetoothв„ў wireless interface for both audio and data applications to the OMAP5910. This is a fairly straightforward effort that requires very little external logic thanks to circuitry in the OMAP5910 that is perfect for supporting a Bluetooth interface. This application note describes how, by using a Bluetooth module, the Blueto
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  OMAP5910 DSP DMA Throughput Analysis
  PDF, 486 Kb, File published: Mar 10, 2003
  The DSP Catalog OMAP? architecture devices contain a six-channel DSP DMA that is used to transfer blocks of data without intervention by the TIARM925T MPU or the C55X DSP. This application report analyzes the DMA throughput between some of the different sources and destinations. Optimization techniques for improving throughput are also discussed. Complete examples are given for using external memo
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  OMAP System DMA Throughput Analysis
  PDF, 524 Kb, File published: Dec 18, 2002
  The OMAP? architecture devices contain a nine-channel system DMA, useable for block transfers of data without intervention by the TIARM925T MPU or the TMSC55x DSP. This application report describes optimization techniques for improving throughput. Examples are given for using external memories such as SDRAM and SRAM for transferring data to and from internal memory. Internal memory transfers are a
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  Configuring Code Composer Studio for OMAP Debugging
  PDF, 271 Kb, File published: Nov 26, 2001
  The OMAP? Code Composer Studio?(CCStudio) Integrated Development Environment (IDE) provides debug support for the OMAP platform via heterogeneous debugging of the TMS470? ARM and TMS320C5000?-based DSP subsystem cores, which are connected on the same JTAG scan path within the device. Simultaneous debug of two or more CPUs, sometimes referred to as co-emulation, allows the user to coordinate debugg
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  Using the CSL to complement OS dispatcher in handling Cascaded Interrupts
  PDF, 299 Kb, File published: Nov 8, 2004
  This application report discusses how CSL's INTC module could be used to share the task of dispatching interrupts with the OS, in scenarios where the OS's interrupt dispatcher does not comprehend cascaded interrupts.The solution involves having the CSL dispatch the cascaded interrupts alone, while completely leaving the job of dispatching primary CPU interrupts to the OS.We also discuss an
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  Programming the DSP MMU in the OMAP5910 Device
  PDF, 476 Kb, File published: Oct 7, 2004
  The OMAP5910 device from Texas Instruments (TI) has a new dual-core architecture that is optimized for multimedia applications in a low-power environment. It couples two processorsВ—a TI-enhanced TI925T general-purpose processor and an ultralow-power TMS320C55xв„ў (C55xв„ў) digital signal processor (DSP)В—with a rich set of peripherals and powerful interfaces to achieve optimal per
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  OMAP591x: Tuning the System Memory Requirements of DSP/BIOS Link
  PDF, 251 Kb, File published: Mar 16, 2005
  The DSP/BIOSв„ў Link software has been designed to implement inter-processor communication between a host device and a DSP. For the case of OMAP591x devices, the default configuration of the DSP/BIOS Link software requires that 2MB of system memory is reserved for exclusive use by DSP/BIOS Link. The intention was to provide developers using DSP/BIOS Link plenty of memory to begin with and enab
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  OMAP5910 Low-Power System Design (Rev. A)
  PDF, 309 Kb, Revision: A, File published: Mar 25, 2004
  The OMAP5910 is a true system-on-a-chip device, which consists of ARM925T MPU and C55X DSP cores. The device has many advanced power management modes that enable system designers to develop a very low-power, multimedia communication device. This application note shows low-power design techniques and outlines the steps required to put the OMAPв„ў device in the lowest power consumption mode and
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  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Kb, Revision: G, File published: Jul 27, 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

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• Semiconductors> Processors> Other Processors