Datasheet Texas Instruments SN74ABTH32245

ManufacturerTexas Instruments
SeriesSN74ABTH32245
Datasheet Texas Instruments SN74ABTH32245

36-Bit Bus Transceivers With 3-State Outputs

Datasheets

36-Bit Bus Transceivers With 3-State Outputs datasheet
PDF, 172 Kb, Revision: G, File published: May 1, 1997
Extract from the document

Prices

Status

SN74ABTH32245PZSN74ABTH32245PZG4
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNo

Packaging

SN74ABTH32245PZSN74ABTH32245PZG4
N12
Pin100100
Package TypePZPZ
Industry STD TermLQFPLQFP
JEDEC CodeS-PQFP-GS-PQFP-G
Package QTY9090
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device MarkingABTH32245ABTH32245
Width (mm)1414
Length (mm)1414
Thickness (mm)1.41.4
Pitch (mm).5.5
Max Height (mm)1.61.6
Mechanical DataDownloadDownload

Parametrics

Parameters / ModelsSN74ABTH32245PZ
SN74ABTH32245PZ
SN74ABTH32245PZG4
SN74ABTH32245PZG4
Bits3636
F @ Nom Voltage(Max), Mhz150150
ICC @ Nom Voltage(Max), mA0.020.02
Operating Temperature Range, C-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max), mA-32/64-32/64
Package GroupLQFPLQFP
Package Size: mm2:W x L, PKG100LQFP: 256 mm2: 16 x 16(LQFP)100LQFP: 256 mm2: 16 x 16(LQFP)
RatingCatalogCatalog
Schmitt TriggerNoNo
Technology FamilyABTABT
VCC(Max), V5.55.5
VCC(Min), V4.54.5
Voltage(Nom), V55
tpd @ Nom Voltage(Max), ns5.25.2

Eco Plan

SN74ABTH32245PZSN74ABTH32245PZG4
RoHSCompliantCompliant

Application Notes

  • Bus-Hold Circuit
    PDF, 418 Kb, File published: Feb 5, 2001
    When designing systems that include CMOS devices, designers must pay special attention to the operating condition in which all of the bus drivers are in an inactive, high-impedance condition (3-state). Unless special measures are taken, this condition can lead to undefined levels and, thus, to a significant increase in the device?s power dissipation. In extreme cases, this leads to oscillation of
  • Quad Flatpack No-Lead Logic Packages (Rev. D)
    PDF, 1.0 Mb, Revision: D, File published: Feb 16, 2004
    Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241 allow for board miniaturization and hold several advantages over traditional SOIC SSOP TSSOP and TVSOP packages. The packages are physically smaller have a smaller routing area improved thermal performance and improved electrical parasitics while
  • Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B)
    PDF, 528 Kb, Revision: B, File published: Jun 1, 1997
    The purpose of this document is to assist the designers of high-performance digital logic systems in using the advanced BiCMOS technology (ABT) logic family. Detailed electrical characteristics of these bus-interface devices are provided and tables and graphs have been included to compare specific parameters of the ABT family with those of other logic families. In addition typical data is provide
  • Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A)
    PDF, 115 Kb, Revision: A, File published: Mar 1, 1997
    Advanced bus-interface logic (ABIL) products processed in submicron advanced BiCMOS technologies (ABT) address the specific end-equipment demands of workstations personal and portable computers and telecommunications markets. This document discusses ABIL as system bus interfaces the merits of ABT its I/O structure packaging and ABT products for end-equipment specific solutions.
  • Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A)
    PDF, 80 Kb, Revision: A, File published: Dec 1, 1996
    This document shows the output skew for the ABT16254 ABT16952 and ABT16500A devices of the TI advanced BiCMOS (ABT) family. The data samples show which output skew is being examined where the data originates and how it is analyzed. Some errors present in the data are discussed. Skew curves at varying temperatures are given for the ABT16240 ABT16245 ABT16952 ABT16500A and ABT16249 devic
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, File published: May 1, 1996
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, File published: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

Model Line

Series: SN74ABTH32245 (2)

Manufacturer's Classification

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Standard Transceiver
EMS supplier