Package Intersil M14.173A
14 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP)
Package Outline Drawing (POD)
Parametrics
Family | TSSOP-EP |
Pin Count | 14 |
Length | 5.00 mm |
Height max | 1.05 mm |
Weight | 0.054 g |
Pitch | 0.65 mm |
Peak Temperature | 240 °C |
Lead Free Peak Temperature | 260 °C |
Features | Exposed Pad |
Package Index | M14.173A |
Model Line
Series: TSSOP (21)
Manufacturer's Classification
- Plastic Packages