Datasheet AD8223 (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | Single-Supply, Low Cost Instrumentation Amplifier |
| Pages / Page | 21 / 8 — AD8223. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 4. Parameter … |
| File Format / Size | PDF / 391 Kb |
| Document Language | English |
AD8223. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 4. Parameter Rating. Table 5. Thermal Resistance. Package Type. JA Unit
Text Version of Document
AD8223 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 4.
θ
Parameter Rating
JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Supply Voltage ±12 V Internal Power Dissipation 650 mW Specification is for the device in free air. Differential Input Voltage ±VS
Table 5. Thermal Resistance
Output Short-Circuit Duration Indefinite
Package Type θ
Storage Temperature Range (R, RM) −65°C to +125°C
JA Unit
Operating Temperature Range −40°C to +85°C 8-Lead SOIC (R) 155 °C/W Lead Temperature (Soldering, 10 sec) 300°C 8-Lead MSOP (RM) 200 °C/W ESD (Human Body Model) 1.5 kV ESD (Charge Device Model) 500 V
ESD CAUTION
ESD (Machine Model) 100 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 7 of 20 Document Outline FEATURES APPLICATIONS CONNECTION DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS SINGLE SUPPLY DUAL SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION AMPLIFIER ARCHITECTURE GAIN SELECTION INPUT VOLTAGE RANGE REFERENCE TERMINAL INPUT PROTECTION RF INTERFERENCE (RFI) GROUND RETURNS FOR INPUT BIAS CURRENTS APPLICATIONS INFORMATION BASIC CONNECTION DIFFERENTIAL OUTPUT OUTPUT BUFFERING CABLES Receiving from a Cable Driving a Cable A SINGLE-SUPPLY DATA ACQUISITION SYSTEM AMPLIFYING SIGNALS WITH LOW COMMON-MODE VOLTAGE OUTLINE DIMENSIONS ORDERING GUIDE
θ
Parameter Rating
JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Supply Voltage ±12 V Internal Power Dissipation 650 mW Specification is for the device in free air. Differential Input Voltage ±VS
Table 5. Thermal Resistance
Output Short-Circuit Duration Indefinite
Package Type θ
Storage Temperature Range (R, RM) −65°C to +125°C
JA Unit
Operating Temperature Range −40°C to +85°C 8-Lead SOIC (R) 155 °C/W Lead Temperature (Soldering, 10 sec) 300°C 8-Lead MSOP (RM) 200 °C/W ESD (Human Body Model) 1.5 kV ESD (Charge Device Model) 500 V
ESD CAUTION
ESD (Machine Model) 100 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 7 of 20 Document Outline FEATURES APPLICATIONS CONNECTION DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS SINGLE SUPPLY DUAL SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION AMPLIFIER ARCHITECTURE GAIN SELECTION INPUT VOLTAGE RANGE REFERENCE TERMINAL INPUT PROTECTION RF INTERFERENCE (RFI) GROUND RETURNS FOR INPUT BIAS CURRENTS APPLICATIONS INFORMATION BASIC CONNECTION DIFFERENTIAL OUTPUT OUTPUT BUFFERING CABLES Receiving from a Cable Driving a Cable A SINGLE-SUPPLY DATA ACQUISITION SYSTEM AMPLIFYING SIGNALS WITH LOW COMMON-MODE VOLTAGE OUTLINE DIMENSIONS ORDERING GUIDE
