link to page 2 link to page 2 link to page 2 NTZD3155CThermal Resistance RatingsParameterSymbolMaxUnit Junction−to−Ambient – Steady State (Note 2) RqJA 500 °C/W Junction−to−Ambient – t = 5 s (Note 2) 447 2. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces). ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) ParameterSymbolN/PTest ConditionMinTypMaxUnitOFF CHARACTERISTICS Drain−to−Source Breakdown Voltage V(BR)DSS N VGS = 0 V ID = 250 mA 20 V P ID = −250 mA −20 Drain−to−Source Breakdown Voltage V(BR)DSS/TJ 18 mV/°C Temperature Coefficient Zero Gate Voltage Drain Current IDSS N VGS = 0 V, VDS = 16 V TJ = 25°C 1.0 mA P VGS = 0 V, VDS= −16 V −1.0 N VGS = 0 V, VDS = 16 V TJ = 125°C 2.0 mA P VGS = 0 V, VDS= − 16V −5.0 Gate−to−Source Leakage Current IGSS P VDS = 0 V, VGS = ±4.5 V $2.0 mA N $5.0 ON CHARACTERISTICS (Note 3) Gate Threshold Voltage VGS(TH) N VGS = VDS ID = 250 mA 0.45 1.0 V P ID = −250 mA −0.45 −1.0 Gate Threshold VGS(TH)/TJ −1.9 −mV/°C Temperature Coefficient Drain−to−Source On Resistance RDS(on) N VGS = 4.5 V, ID = 540 mA 0.4 0.55 P VGS = −4.5V, ID = −430 mA 0.5 0.9 N VGS = 2.5 V, ID = 500 mA 0.5 0.7 W P VGS = −2.5V, ID = −300 mA 0.6 1.2 N VGS = 1.8 V, ID = 350 mA 0.7 0.9 P VGS = −1.8V, ID = −150 mA 1.0 2.0 Forward Transconductance gFS N VDS = 10 V, ID = 540 mA 1.0 S P VDS = −10 V, ID = −430 mA 1.0 CHARGES, CAPACITANCES AND GATE RESISTANCE Input Capacitance CISS 80 150 Output Capacitance COSS N f = 1 MHz, VGS = 0 V 13 25 VDS = 16 V Reverse Transfer Capacitance CRSS 10 20 pF Input Capacitance CISS 105 175 Output Capacitance COSS P f = 1 MHz, VGS = 0 V 15 30 VDS = −16 V Reverse Transfer Capacitance CRSS 10 20 3. Pulse Test: pulse width v300 ms, duty cycle v2% Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com2