Datasheet AMP03 (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | Precision, Unity-Gain Differential Amplifier |
| Pages / Page | 8 / 8 — AMP03. OUTLINE DIMENSIONS. 8-Lead Small Outline Package [SOIC]. 8-Lead … |
| Revision | F |
| File Format / Size | PDF / 269 Kb |
| Document Language | English |
AMP03. OUTLINE DIMENSIONS. 8-Lead Small Outline Package [SOIC]. 8-Lead Plastic Dual In-Line Package [PDIP]. [S Suffix]
Model Line for this Datasheet
Text Version of Document
AMP03 OUTLINE DIMENSIONS 8-Lead Small Outline Package [SOIC] 8-Lead Plastic Dual In-Line Package [PDIP] [S Suffix] [P Suffix] (R-8) (N-8)
Dimensions shown in millimeters and (inches) Dimensions shown in inches and (millimeters)
5.00 (0.1968) 0.375 (9.53) 4.80 (0.1890) 0.365 (9.27) 0.355 (9.02) 8 5 4.00 (0.1574) 6.20 (0.2440) 8 5 0.295 (7.49) 3.80 (0.1497) 1 4 5.80 (0.2284) 0.285 (7.24)
C00249–0–12/03(F)
1 4 0.275 (6.98) 0.325 (8.26) 1.27 (0.0500) 0.50 (0.0196) 0.310 (7.87) 1.75 (0.0688)
ⴛ
45
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0.100 (2.54) BSC 0.25 (0.0099) 0.300 (7.62) 0.150 (3.81) BSC 1.35 (0.0532) 0.135 (3.43) 0.25 (0.0098) 0.015 0.120 (3.05) 0.10 (0.0040) 0.180 (0.38) 8 0.51 (0.0201)
ⴗ
(4.57) MIN 0 COPLANARITY
ⴗ
1.27 (0.0500) MAX 0.31 (0.0122) 0.25 (0.0098) SEATING 0.10 0.015 (0.38) 0.17 (0.0067) 0.40 (0.0157) PLANE 0.150 (3.81) SEATING 0.010 (0.25) 0.130 (3.30) PLANE 0.008 (0.20) COMPLIANT TO JEDEC STANDARDS MS-012AA 0.110 (2.79) 0.060 (1.52) CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR 0.022 (0.56) 0.050 (1.27) REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN 0.018 (0.46) 0.045 (1.14) 0.014 (0.36) COMPLIANT TO JEDEC STANDARDS MO-095AA CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN 8-Lead Metal Can [TO-99] [J Suffix] (H-08B)
Dimensions shown in inches and (millimeters)
REFERENCE PLANE 0.5000 (12.70) MIN 0.1850 (4.70) 0.2500 (6.35) MIN 0.1650 (4.19) 0.1000 (2.54) BSC 0.0500 (1.27) MAX 0.1600 (4.06) 0.1400 (3.56) 5 6 4 0.0450 (1.14) 0.2000 0.0270 (0.69) (5.08) 3 7 BSC 0.3700 (9.40) 0.3350 (8.51) 0.3350 (8.51) 0.3050 (7.75) 2 8 1 0.0190 (0.48) 0.1000 (2.54) 0.0160 (0.41) BSC 0.0400 (1.02) MAX 0.0340 (0.86) 0.0210 (0.53) 0.0280 (0.71) 0.0400 (1.02) 0.0160 (0.41) 0.0100 (0.25) 45 BSC BASE & SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-002AK CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN Revision History Location Page 12/03—Data Sheet changed from REV. E to REV. F.
Changes to ELECTRICAL CHARACTERISTICS . 2 Changes to ORDERING GUIDE . 3 Updated OUTLINE DIMENSIONS . 7 –8– REV. F Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PIN CONNECTIONS SPECIFICATIONS WAFER TEST LIMITS ABSOLUTE MAXIMUM RATINGS ORDERING GUIDE DICE CHARACTERISTICS BURN-IN CIRCUIT SLEW RATE TEST CIRCUIT Typical Performance Characteristics APPLICATION CIRCUITS APPLICATIONS INFORMATION MAINTAINING COMMON-MODE REJECTION OUTLINE DIMENSIONS Revision History
Dimensions shown in millimeters and (inches) Dimensions shown in inches and (millimeters)
5.00 (0.1968) 0.375 (9.53) 4.80 (0.1890) 0.365 (9.27) 0.355 (9.02) 8 5 4.00 (0.1574) 6.20 (0.2440) 8 5 0.295 (7.49) 3.80 (0.1497) 1 4 5.80 (0.2284) 0.285 (7.24)
C00249–0–12/03(F)
1 4 0.275 (6.98) 0.325 (8.26) 1.27 (0.0500) 0.50 (0.0196) 0.310 (7.87) 1.75 (0.0688)
ⴛ
45
ⴗ
0.100 (2.54) BSC 0.25 (0.0099) 0.300 (7.62) 0.150 (3.81) BSC 1.35 (0.0532) 0.135 (3.43) 0.25 (0.0098) 0.015 0.120 (3.05) 0.10 (0.0040) 0.180 (0.38) 8 0.51 (0.0201)
ⴗ
(4.57) MIN 0 COPLANARITY
ⴗ
1.27 (0.0500) MAX 0.31 (0.0122) 0.25 (0.0098) SEATING 0.10 0.015 (0.38) 0.17 (0.0067) 0.40 (0.0157) PLANE 0.150 (3.81) SEATING 0.010 (0.25) 0.130 (3.30) PLANE 0.008 (0.20) COMPLIANT TO JEDEC STANDARDS MS-012AA 0.110 (2.79) 0.060 (1.52) CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR 0.022 (0.56) 0.050 (1.27) REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN 0.018 (0.46) 0.045 (1.14) 0.014 (0.36) COMPLIANT TO JEDEC STANDARDS MO-095AA CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN 8-Lead Metal Can [TO-99] [J Suffix] (H-08B)
Dimensions shown in inches and (millimeters)
REFERENCE PLANE 0.5000 (12.70) MIN 0.1850 (4.70) 0.2500 (6.35) MIN 0.1650 (4.19) 0.1000 (2.54) BSC 0.0500 (1.27) MAX 0.1600 (4.06) 0.1400 (3.56) 5 6 4 0.0450 (1.14) 0.2000 0.0270 (0.69) (5.08) 3 7 BSC 0.3700 (9.40) 0.3350 (8.51) 0.3350 (8.51) 0.3050 (7.75) 2 8 1 0.0190 (0.48) 0.1000 (2.54) 0.0160 (0.41) BSC 0.0400 (1.02) MAX 0.0340 (0.86) 0.0210 (0.53) 0.0280 (0.71) 0.0400 (1.02) 0.0160 (0.41) 0.0100 (0.25) 45 BSC BASE & SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-002AK CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN Revision History Location Page 12/03—Data Sheet changed from REV. E to REV. F.
Changes to ELECTRICAL CHARACTERISTICS . 2 Changes to ORDERING GUIDE . 3 Updated OUTLINE DIMENSIONS . 7 –8– REV. F Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PIN CONNECTIONS SPECIFICATIONS WAFER TEST LIMITS ABSOLUTE MAXIMUM RATINGS ORDERING GUIDE DICE CHARACTERISTICS BURN-IN CIRCUIT SLEW RATE TEST CIRCUIT Typical Performance Characteristics APPLICATION CIRCUITS APPLICATIONS INFORMATION MAINTAINING COMMON-MODE REJECTION OUTLINE DIMENSIONS Revision History
