Datasheet MURA115, MURA120, NRVUA120V, SURA8120 (ON Semiconductor)

ManufacturerON Semiconductor
DescriptionULTRAFAST RECTIFIERS 1 AMPERE, 100−200 VOLTS
Pages / Page6 / 1 — www.onsemi.com. Features. ULTRAFAST RECTIFIERS. 1 AMPERE, 100−200 VOLTS. …
Revision10
File Format / SizePDF / 141 Kb
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www.onsemi.com. Features. ULTRAFAST RECTIFIERS. 1 AMPERE, 100−200 VOLTS. SMA. CASE 403D. Mechanical Characteristics:. MARKING DIAGRAM

Datasheet MURA115, MURA120, NRVUA120V, SURA8120 ON Semiconductor, Revision: 10

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MURA115, MURA120, NRVUA120V, SURA8120 Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications
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where compact size and weight are critical to the system.
Features ULTRAFAST RECTIFIERS
• Small Compact Surface Mountable Package with J−Bend Leads
1 AMPERE, 100−200 VOLTS
• Rectangular Package for Automated Handling • High Temperature Glass Passivated Junction • Low Forward Voltage Drop (0.71 V Max @ 1.0 A, TJ = 150°C) • NRVUA and SURA8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
SMA
• These Devices are Pb−Free and are RoHS Compliant*
CASE 403D Mechanical Characteristics: MARKING DIAGRAM
• Case: Epoxy, Molded • Weight: 70 mg (Approximately) • U4x Finish: All External Surfaces Corrosion Resistant and Terminal AYWW G Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds U4x = Device Code • x = C for MURA115 Polarity: Polarity Band Indicates Cathode Lead = D for MURA120 • ESD Protection: A = Assembly Location ♦ Human Body Model > 4000 V (Class 3) Y = Year WW = Work Week ♦ Machine Model > 400 V (Class C) G = Pb−Free Package
ORDERING INFORMATION Device Package Shipping
† MURA115T3G SMA 5,000/Tape & Reel (Pb−Free) MURA120T3G SMA 5,000/Tape & Reel (Pb−Free) NRVUA120VT3G SMA 5,000/Tape & Reel (Pb−Free) SURA8120T3G SMA 5,000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2017
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Publication Order Number:
February, 2017 − Rev. 10 MURA115T3/D
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