Datasheet LM35 - 3
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LM35. www.ti.com. 5 Pin Configuration and Functions. NDV Package. NEB Package. 3-Pin TO-CAN. 3-Pin TO-220. (Top View). D Package
Text Version of Document
LM35 www.ti.com
SNIS159E – AUGUST 1999 – REVISED JANUARY 2015
5 Pin Configuration and Functions NDV Package NEB Package 3-Pin TO-CAN 3-Pin TO-220 (Top View) (Top View)
+V V S OUT GND t LM Case is connected to negative pin (GND) 35DT
D Package 8-PIN SOIC (Top View)
V 1 8 +V OUT S N.C. N.C. 2 7 +V V N.C. N.C. 3 6 S OUT GND GND N.C. 4 5 Tab is connected to the negative pin (GND).
NOTE:
The LM35DT pinout is different than N.C. = No connection the discontinued LM35DP
LP Package 3-Pin TO-92 (Bottom View)
+V V GND S OUT
Pin Functions PIN TYPE DESCRIPTION NAME TO46 TO92 TO220 SO8
VOUT — — — 1 O Temperature Sensor Analog Output — — — 2 N.C. — No Connection — — — 3 Device ground pin, connect to power supply negative GND — — — 4 GROUND terminal — — — 5 N.C. — — — 6 — No Connection — — — 7 +VS — — — 8 POWER Positive power supply pin Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM35 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics: LM35A, LM35CA Limits 6.6 Electrical Characteristics: LM35A, LM35CA 6.7 Electrical Characteristics: LM35, LM35C, LM35D Limits 6.8 Electrical Characteristics: LM35, LM35C, LM35D 6.9 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 LM35 Transfer Function 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.1.1 Capacitive Drive Capability 8.2 Typical Application 8.2.1 Basic Centigrade Temperature Sensor 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curve 8.3 System Examples 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Trademarks 11.2 Electrostatic Discharge Caution 11.3 Glossary 12 Mechanical, Packaging, and Orderable Information
SNIS159E – AUGUST 1999 – REVISED JANUARY 2015
5 Pin Configuration and Functions NDV Package NEB Package 3-Pin TO-CAN 3-Pin TO-220 (Top View) (Top View)
+V V S OUT GND t LM Case is connected to negative pin (GND) 35DT
D Package 8-PIN SOIC (Top View)
V 1 8 +V OUT S N.C. N.C. 2 7 +V V N.C. N.C. 3 6 S OUT GND GND N.C. 4 5 Tab is connected to the negative pin (GND).
NOTE:
The LM35DT pinout is different than N.C. = No connection the discontinued LM35DP
LP Package 3-Pin TO-92 (Bottom View)
+V V GND S OUT
Pin Functions PIN TYPE DESCRIPTION NAME TO46 TO92 TO220 SO8
VOUT — — — 1 O Temperature Sensor Analog Output — — — 2 N.C. — No Connection — — — 3 Device ground pin, connect to power supply negative GND — — — 4 GROUND terminal — — — 5 N.C. — — — 6 — No Connection — — — 7 +VS — — — 8 POWER Positive power supply pin Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM35 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics: LM35A, LM35CA Limits 6.6 Electrical Characteristics: LM35A, LM35CA 6.7 Electrical Characteristics: LM35, LM35C, LM35D Limits 6.8 Electrical Characteristics: LM35, LM35C, LM35D 6.9 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 LM35 Transfer Function 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.1.1 Capacitive Drive Capability 8.2 Typical Application 8.2.1 Basic Centigrade Temperature Sensor 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curve 8.3 System Examples 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Trademarks 11.2 Electrostatic Discharge Caution 11.3 Glossary 12 Mechanical, Packaging, and Orderable Information
