Datasheet LM2734 (Texas Instruments) - 4
| Manufacturer | Texas Instruments |
| Description | Thin SOT 1-A Load Step-Down DC-DC Regulator |
| Pages / Page | 37 / 4 — LM2734. www.ti.com. 6 Specifications. 6.1 Absolute Maximum Ratings. MIN. … |
| Revision | J |
| File Format / Size | PDF / 1.6 Mb |
| Document Language | English |
LM2734. www.ti.com. 6 Specifications. 6.1 Absolute Maximum Ratings. MIN. MAX. UNIT. 6.2 ESD Ratings. VALUE
Text Version of Document
LM2734
SNVS288J – SEPTEMBER 2004 – REVISED DECEMBER 2014
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted)(1)(2)
MIN MAX UNIT
VIN -0.5 24 V SW Voltage -0.5 24 V Boost Voltage -0.5 30 V Boost to SW Voltage -0.5 6.0 V FB Voltage -0.5 0.3 V EN Voltage -0.5 VIN + 0.3 V Junction Temperature 150 °C Soldering Information Reflow Peak Pkg. Temp.(15s) 260 °C Tstg Storage temperature -65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
6.2 ESD Ratings VALUE UNIT
VESD Electrostatic discharge Human Body Model (HBM), per ANSI/ESDA/JEDEC JS001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN 3 20 V SW Voltage -0.5 20 V Boost Voltage -0.5 25 V Boost to SW Voltage 1.6 5.5 V Junction Temperature Range −40 125 °C
6.4 Thermal Information LM2734 THERMAL METRIC(1) DDC UNIT 6 PINS
RθJA Junction-to-ambient thermal resistance 158.1 RθJC(top) Junction-to-case (top) thermal resistance 46.5 RθJB Junction-to-board thermal resistance 29.5 °C/W ψJT Junction-to-top characterization parameter 0.8 ψJB Junction-to-board characterization parameter 29.2 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2004–2014, Texas Instruments Incorporated Product Folder Links: LM2734 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Typical Performance Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Output Overvoltage Protection 7.3.2 Undervoltage Lockout 7.3.3 Current Limit 7.3.4 Thermal Shutdown 7.4 Device Functional Modes 7.4.1 Enable Pin / Shutdown Mode 7.4.2 Soft-Start 8 Application and Implementation 8.1 Application Information 8.1.1 Boost Function 8.2 Typical Applications 8.2.1 LM2734X (1.6 MHz) VBOOST Derived from VIN 5V to 1.5 V/1 A 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curves 8.2.2 LM2734X (1.6 MHz) VBOOST Derived from VOUT 12 V to 3.3 V /1 A 8.2.2.1 Design Requirements 8.2.2.2 Detailed Design Procedure 8.2.2.3 Application Curves 8.2.3 LM2734X (1.6 MHz) VBOOST Derived from VSHUNT 18 V to 1.5 V /1 A 8.2.3.1 Design Requirements 8.2.3.2 Detailed Design Procedure 8.2.3.3 Application Curves 8.2.4 LM2734X (1.6 MHz) VBOOST Derived from Series Zener Diode (VIN) 15 V to 1.5 V / 1 A 8.2.4.1 Design Requirements 8.2.4.2 Detailed Design Procedure 8.2.4.3 Application Curves 8.2.5 LM2734X (1.6 MHz) VBOOST Derived from Series Zener Diode (VOUT) 15 V to 9 V /1 A 8.2.5.1 Design Requirements 8.2.5.2 Detailed Design Procedure 8.2.5.3 Application Curves 8.2.6 LM2734Y (550 kHz) VBOOST Derived from VIN 5 V to 1.5 V / 1 A 8.2.6.1 Design Requirements 8.2.6.2 Detailed Design Procedure 8.2.6.3 Application Curves 8.2.7 LM2734Y (550 kHz) VBOOST Derived from VOUT 12 V to 3.3 V / 1 A 8.2.7.1 Design Requirements 8.2.7.2 Detailed Design Procedure 8.2.7.3 Application Curves 8.2.8 LM2734Y (550 kHz) VBOOST Derived from VSHUNT 18 V to 1.5 V / 1 A 8.2.8.1 Design Requirements 8.2.8.2 Detailed Design Procedure 8.2.8.3 Application Curves 8.2.9 LM2734Y (550 kHz) VBOOST Derived from Series Zener Diode (VIN) 15 V to 1.5 V / 1 A 8.2.9.1 Design Requirements 8.2.9.2 Detailed Design Procedure 8.2.9.3 Application Curves 8.2.10 LM2734Y (550 kHz) VBOOST Derived from Series Zener Diode (VOUT) 15 V to 9 V / 1 A 8.2.10.1 Design Requirements 8.2.10.2 Detailed Design Procedure 8.2.10.3 Application Curves 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Third-Party Products Disclaimer 11.2 Trademarks 11.3 Electrostatic Discharge Caution 11.4 Glossary 12 Mechanical, Packaging, and Orderable Information
SNVS288J – SEPTEMBER 2004 – REVISED DECEMBER 2014
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted)(1)(2)
MIN MAX UNIT
VIN -0.5 24 V SW Voltage -0.5 24 V Boost Voltage -0.5 30 V Boost to SW Voltage -0.5 6.0 V FB Voltage -0.5 0.3 V EN Voltage -0.5 VIN + 0.3 V Junction Temperature 150 °C Soldering Information Reflow Peak Pkg. Temp.(15s) 260 °C Tstg Storage temperature -65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
6.2 ESD Ratings VALUE UNIT
VESD Electrostatic discharge Human Body Model (HBM), per ANSI/ESDA/JEDEC JS001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN 3 20 V SW Voltage -0.5 20 V Boost Voltage -0.5 25 V Boost to SW Voltage 1.6 5.5 V Junction Temperature Range −40 125 °C
6.4 Thermal Information LM2734 THERMAL METRIC(1) DDC UNIT 6 PINS
RθJA Junction-to-ambient thermal resistance 158.1 RθJC(top) Junction-to-case (top) thermal resistance 46.5 RθJB Junction-to-board thermal resistance 29.5 °C/W ψJT Junction-to-top characterization parameter 0.8 ψJB Junction-to-board characterization parameter 29.2 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2004–2014, Texas Instruments Incorporated Product Folder Links: LM2734 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Typical Performance Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Output Overvoltage Protection 7.3.2 Undervoltage Lockout 7.3.3 Current Limit 7.3.4 Thermal Shutdown 7.4 Device Functional Modes 7.4.1 Enable Pin / Shutdown Mode 7.4.2 Soft-Start 8 Application and Implementation 8.1 Application Information 8.1.1 Boost Function 8.2 Typical Applications 8.2.1 LM2734X (1.6 MHz) VBOOST Derived from VIN 5V to 1.5 V/1 A 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curves 8.2.2 LM2734X (1.6 MHz) VBOOST Derived from VOUT 12 V to 3.3 V /1 A 8.2.2.1 Design Requirements 8.2.2.2 Detailed Design Procedure 8.2.2.3 Application Curves 8.2.3 LM2734X (1.6 MHz) VBOOST Derived from VSHUNT 18 V to 1.5 V /1 A 8.2.3.1 Design Requirements 8.2.3.2 Detailed Design Procedure 8.2.3.3 Application Curves 8.2.4 LM2734X (1.6 MHz) VBOOST Derived from Series Zener Diode (VIN) 15 V to 1.5 V / 1 A 8.2.4.1 Design Requirements 8.2.4.2 Detailed Design Procedure 8.2.4.3 Application Curves 8.2.5 LM2734X (1.6 MHz) VBOOST Derived from Series Zener Diode (VOUT) 15 V to 9 V /1 A 8.2.5.1 Design Requirements 8.2.5.2 Detailed Design Procedure 8.2.5.3 Application Curves 8.2.6 LM2734Y (550 kHz) VBOOST Derived from VIN 5 V to 1.5 V / 1 A 8.2.6.1 Design Requirements 8.2.6.2 Detailed Design Procedure 8.2.6.3 Application Curves 8.2.7 LM2734Y (550 kHz) VBOOST Derived from VOUT 12 V to 3.3 V / 1 A 8.2.7.1 Design Requirements 8.2.7.2 Detailed Design Procedure 8.2.7.3 Application Curves 8.2.8 LM2734Y (550 kHz) VBOOST Derived from VSHUNT 18 V to 1.5 V / 1 A 8.2.8.1 Design Requirements 8.2.8.2 Detailed Design Procedure 8.2.8.3 Application Curves 8.2.9 LM2734Y (550 kHz) VBOOST Derived from Series Zener Diode (VIN) 15 V to 1.5 V / 1 A 8.2.9.1 Design Requirements 8.2.9.2 Detailed Design Procedure 8.2.9.3 Application Curves 8.2.10 LM2734Y (550 kHz) VBOOST Derived from Series Zener Diode (VOUT) 15 V to 9 V / 1 A 8.2.10.1 Design Requirements 8.2.10.2 Detailed Design Procedure 8.2.10.3 Application Curves 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Third-Party Products Disclaimer 11.2 Trademarks 11.3 Electrostatic Discharge Caution 11.4 Glossary 12 Mechanical, Packaging, and Orderable Information
