Datasheet MCP6481, MCP6482, MCP6484 (Microchip)

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MCP6481/2/4 4 MHz, Low-Input Bias Current Op Amps Features Description • Low-Input Bias Current
The Microchip MCP6481/2/4 family of operational - 150 pA (typical, T amplifiers (op amps) has low-input bias current A = +125°C)
• Low Quiescent Current
(150 pA, typical at 125°C) and rail-to-rail input and output operation. This family is unity gain stable and - 240 µA/amplifier (typical) has a gain bandwidth product of 4 MHz (typical). These
• Low-Input Offset Voltage
devices operate with a single-supply voltage as low as - ±1.5 mV (maximum) 2.2V, while only drawing 240 µA/amplifier (typical) of • Supply Voltage Range: 2.2V to 5.5V quiescent current. These features make the family of • Rail-to-Rail Input/Output op amps well suited for photodiode amplifier, pH electrode amplifier, low leakage amplifier, and battery- • Gain Bandwidth Product: 4 MHz (typical) powered signal conditioning applications, etc. • Slew Rate: 2.7 V/µs (typical) The MCP6481/2/4 family is offered in single • Unity Gain Stable (MCP6481), dual (MCP6482), quad (MCP6484) • No Phase Reversal packages. All devices are designed using an advanced • Small Packages CMOS process and fully specified in extended - Singles in SC70-5, SOT-23-5 temperature range from -40°C to +125°C. • Extended Temperature Range - -40°C to +125°C
Related Parts
• MCP6471/2/4: 2 MHz, Low-Input Bias Current Op
Applications
Amps • Photodiode Amplifier • MCP6491/2/4: 7.5 MHz, Low-Input Bias Current • pH Electrode Amplifier Op Amps • Low Leakage Amplifier • Piezoelectric Transducer Amplifier • Active Analog Filter • Battery-Powered Signal Conditioning
Design Aids
• SPICE Macro Models • FilterLab® Software • MAPS (Microchip Advanced Part Selector) • Analog Demonstration and Evaluation Boards • Application Notes
Package Types MCP6481 MCP6482 MCP6482 MCP6484
SC70, SOT-23 SOIC, MSOP 2x3 TDFN* SOIC, TSSOP V 1 5 V OUT DD V 1 8 V VOUTA 1 8 V VOUTA 1 14 OUTA DD DD VOUTD V 2 SS V 2 7 V INA– VOUTB V 2 EP 7 V VINA– 2 13 INA– OUTB IND– V 3 4 IN+ VIN– V 3 6 9 INA+ VINB– V 3 6 V V 3 12 V INA+ INB– INA+ IND+ V 4 5 SS VINB+ V 4 5 V 4 11 V SS VINB+ DD SS V 5 10 INB+ VINC+ V 6 9 INB– VINC– * Includes Exposed Thermal Pad (EP); see Table 3-1. V 7 8 OUTB VOUTC  2012-2013 Microchip Technology Inc. DS20002322C-page 1 Document Outline Package Types Typical Application 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Frequency. FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-16: Quiescent Current vs. Power Supply Voltage. FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-22: Output Voltage Swing vs. Frequency. FIGURE 2-23: Output Voltage Headroom vs. Output Current. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-27: Slew Rate vs. Ambient Temperature. FIGURE 2-28: Small Signal Non-Inverting Pulse Response. FIGURE 2-29: Small Signal Inverting Pulse Response. FIGURE 2-30: Large Signal Non-Inverting Pulse Response. FIGURE 2-31: Large Signal Inverting Pulse Response. FIGURE 2-32: The MCP6481/2/4 Shows No Phase Reversal. FIGURE 2-33: Closed Loop Output Impedance vs. Frequency. FIGURE 2-34: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-35: Channel-to-Channel Separation vs. Frequency (MCP6482/4 only). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Application Information 4.1 Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Application Circuits FIGURE 4-8: Photovoltaic Mode Detector. FIGURE 4-9: Photoconductive Mode Detector. FIGURE 4-10: Second-Order, Low-Pass Butterworth Filter with Sallen-Key Topology. FIGURE 4-11: Second-Order, Low-Pass Butterworth Filter with Multiple-Feedback Topology. FIGURE 4-12: pH Electrode Amplifier. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab Software 5.3 MAPS (Microchip Advanced Part Selector) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service