Datasheet BAT46 (STMicroelectronics) - 10

ManufacturerSTMicroelectronics
DescriptionSmall signal Schottky diodes
Pages / Page11 / 10 — Ordering information. BAT46 Series. 4 Ordering. information. Part Number. …
File Format / SizePDF / 158 Kb
Document LanguageEnglish

Ordering information. BAT46 Series. 4 Ordering. information. Part Number. Marking. Package. Weight. Base qty. Delivery mode. 5 Revision

Ordering information BAT46 Series 4 Ordering information Part Number Marking Package Weight Base qty Delivery mode 5 Revision

Model Line for this Datasheet

Text Version of Document

Ordering information BAT46 Series 4 Ordering information Part Number Marking Package Weight Base qty Delivery mode
BAT46ZFILM Z46 SOD-123 Single 10 mg 3000 Tape and reel BAT46FILM S46 SOT-23 Single 10 mg 3000 Tape and reel SOT-23 BAT46AFILM A46 10 mg 3000 Tape and reel Common anode SOT-23 BAT46CFILM C46 10 mg 3000 Tape and reel Common cathode BAT46SFILM B46 SOT-23 Series 10 mg 3000 Tape and reel BAT46WFILM D46 SOT-323 Single 6 mg 3000 Tape and reel SOT-323 BAT46AWFILM DB6 6 mg 3000 Tape and reel Common anode SOT-323 BAT46CWFILM DB8 6 mg 3000 Tape and reel Common cathode BAT46SWFILM B46 SOT-323 Series 6 mg 3000 Tape and reel BAT46JFILM 46 SOD-323 5 mg 3000 Tape and reel
5 Revision history Date Revision Description of Changes
Jun-1999 3 Previous revision. BAT46Z, J, W datasheets merged. ECOPACK statement 25-Jul-2006 4 added. 10/11 Document Outline BAT46 Series Small signal Schottky diodes 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25˚ C, unless otherwise specified) Table 2. Thermal parameters Table 3. Static electrical characteristics Table 4. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values, low-level) Figure 7. Forward voltage drop versus forward current (typical values, high-level) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4 eCU = 35 µm (SOD-323) Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration - aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) Figure 10. Variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4, eCU = 35 µm (SOT-323) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead, epoxy FR4, eCU = 35 µm (SOD-323) 2 Ordering information scheme 3 Package information Table 5. SOD-123 dimensions Figure 12. SOD-123 footprint (dimensions in mm) Table 6. SOD-323 dimensions Figure 13. SOD-323 footprint (dimensions in mm) Table 7. SOT-23 dimensions Figure 14. SOT-23 footprint (dimensions in mm) Table 8. SOT-323 dimensions Figure 15. SOT-323 footprint (dimensions in mm) 4 Ordering information 5 Revision history
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