Datasheet J110 (ON Semiconductor) - 2
Manufacturer | ON Semiconductor |
Description | JFET − General Purpose N−Channel − Depletion |
Pages / Page | 5 / 2 — N−Channel − Depletion. http://onsemi.com. Features. MARKING DIAGRAM. … |
File Format / Size | PDF / 111 Kb |
Document Language | English |
N−Channel − Depletion. http://onsemi.com. Features. MARKING DIAGRAM. MAXIMUM RATINGS. Rating. Symbol. Value. Unit. CASE 29. TO−92 (TO−226)
Model Line for this Datasheet
Text Version of Document
J110 JFET − General Purpose
N−Channel − Depletion
N−Channel Junction Field Effect Transistors, depletion mode (Type A) designed for general purpose audio amplifiers, analog switches and choppers.
http://onsemi.com Features
1 DRAIN • N−Channel for Higher Gain • Drain and Source Interchangeable • 3 High AC Input Impedance GATE • High DC Input Resistance • Low RDS(on) < 18 W • 2 SOURCE Fast Switching td(on) + tr = 8.0 ns (Typ) • Low Noise en = 6.0 nV/√Hz @ 10 Hz (Typ) • Pb−Free Packages are Available*
MARKING DIAGRAM MAXIMUM RATINGS Rating Symbol Value Unit
Gate−Source Voltage VG
CASE 29
J110 S −25 Vdc
TO−92 (TO−226)
AYWW G Drain −Gate Voltage VDG −25 Vdc
STYLE 5
G 1 Gate Current I 2 G 10 mAdc 3 Total Device Dissipation PD @ TA = 25°C 310 mW Derate above 25°C 2.82 mW/°C J110 = Device Code A = Assembly Location Operating Junction Temp Range TJ 135 °C Y = Year Storage Temperature Range T WW = Work Week stg −65 to +150 °C G = Pb−Free Package Maximum ratings are those values beyond which device damage can occur. (Note: Microdot may be in either location) Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
ORDERING INFORMATION Device Package Shipping
† J110 TO−92 1000 Units / Box J110G TO−92 1000 Units / Box (Pb−Free) J110RLRA TO−92 2000 / Tape & Reel J110RLRAG TO−92 2000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Preferred
devices are recommended choices for future use and best overall value. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
November, 2005 − Rev. 6 J110/D