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Datasheet Texas Instruments MSP430FR5724IRGER

Datasheet Texas Instruments MSP430FR5724IRGER

ManufacturerTexas Instruments
SeriesMSP430FR5724
Part NumberMSP430FR5724IRGER

MSP430FR5724 8 MHz ULP microcontroller with 8 KB FRAM, 1 KB SRAM, 21 IO, 10-bit ADC and comparator 24-VQFN -40 to 85

Datasheets

  • Download » Datasheet, PDF, 2.2 Mb, Revision: B, 04-25-2016
    MSP430FR572x Mixed-Signal Microcontrollers datasheet
    Docket ↓
    Product
    Folder Order
    Now Technical
    Documents Tools &
    Software Support &
    Community MSP430FR5729, MSP430FR5728, MSP430FR5727, MSP430FR5726, MSP430FR5725
    MSP430FR5724, MSP430FR5723, MSP430FR5722, MSP430FR5721, MSP430FR5720
    SLASE35C – MAY 2014 – REVISED DECEMBER 2017 MSP430FR572x Mixed-Signal Microcontrollers
    1 Device Overview
    1.1 Features 1 Embedded Microcontroller
    – 16-Bit RISC Architecture up to 8-MHz Clock
    – Wide Supply Voltage Range (2 V to 3.6 V)
    – –40°C to 85°C Operation Optimized Ultra-Low-Power Modes
    – Active Mode: 81.4 µA/MHz (Typical)
    – Standby (LPM3 With VLO): 6.3 µA (Typical)
    – Real-Time Clock (RTC) (LPM3.5 With Crystal):
    1.5 µA (Typical)
    – Shutdown (LPM4.5): 0.32 µA (Typical) Ultra-Low-Power Ferroelectric RAM (FRAM)
    – Up to 16KB of Nonvolatile Memory
    – Ultra-Low-Power Writes
    – Fast Write at 125 ns per Word (16KB in 1 ms)
    – Built-In Error Correction Coding (ECC) and
    Memory Protection Unit (MPU) ...

Prices

Family: MSP430FR5720, MSP430FR5721, MSP430FR5722, MSP430FR5723, MSP430FR5724, MSP430FR5725, MSP430FR5726, MSP430FR5727, MSP430FR5728, MSP430FR5729

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Packaging

Pin2424
Package TypeRGERGE
Industry STD TermVQFNVQFN
JEDEC CodeS-PQFP-NS-PQFP-N
Package QTY30003000
CarrierLARGE T&RLARGE T&R
Device Marking5724430FR
Width (mm)44
Length (mm)44
Thickness (mm).88.88
Pitch (mm).5.5
Max Height (mm)11
Mechanical DataDownload »Download »

Parametrics

ADCADC10 - 8ch
AESN/A
Active Power125 uA/MHz
Additional FeaturesReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
BSLUART
CPUMSP430
Comparators12
DMA3
Featuredfr5
Frequency8 MHz
GPIO Pins21
I2C1
Max VCC3.6
Min VCC2
Multiplier32x32
Non-volatile Memory8 KB
Operating Temperature Range-40 to 85 C
Package GroupVQFN
Package Size: mm2:W x L24VQFN: 16 mm2: 4 x 4(VQFN) PKG
RAM1 KB
RatingCatalog
SPI2
Security EnablerCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection
Special I/ON/A
Standby Power6.4 LPM3-uA
Timers - 16-bit3
UART1
Wakeup Time78 us

Eco Plan

RoHSCompliant

Design Kits & Evaluation Modules

  • Evaluation Modules & Boards: MSP-TS430RHA40A
    MSP-TS430RHA40A- 40-pin Target Development Board for MSP430FRxx FRAM MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: MSP-FET430U40A
    40-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Lifecycle Status: Active (Recommended for new designs)

Application Notes

  • Download » Application Notes, PDF, 3.5 Mb, Revision: A, 03-02-2015
    Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
  • Download » Application Notes, PDF, 1.5 Mb, 03-29-2012
    MSP430 System-Level ESD Considerations
    System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ
  • Download » Application Notes, PDF, 103 Kb, Revision: B, 02-04-2015
    Maximizing Write Speed on the MSP430™ FRAM (Rev. B)
    Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430™ FRAM-based devices, and discusses tradeoffs such as
  • Download » Application Notes, PDF, 326 Kb, 06-23-2014
    MSP430 FRAM Technology – How To and Best Practices
    FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
  • Download » Application Notes, PDF, 295 Kb, Revision: A, 05-01-2014
    MSP430 FRAM Quality and Reliability (Rev. A)
    FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
  • Download » Application Notes, PDF, 41 Kb, Revision: A, 09-13-2012
    Migrating from the USCI Module to the eUSCI Module (Rev. A)
    The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
  • Download » Application Notes, PDF, 154 Kb, Revision: A, 02-16-2012
    Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
    This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (
  • Download » Application Notes, PDF, 551 Kb, Revision: A, 04-01-2016
    General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • Download » Application Notes, PDF, 475 Kb, 10-05-2012
    Design Considerations When Using the MSP430 Graphics Library
    LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430™ MCU. This

Moldel Line

Series: MSP430FR5724 (4)

Manufacturer's Classification

  • Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430FRxx FRAM
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