Datasheet Texas Instruments TPA3106D1VFPG4
| Manufacturer | Texas Instruments |
| Series | TPA3106D1 |
| Part Number | TPA3106D1VFPG4 |
40-W Mono Class-D Audio Power Amplifier (TPA3106) 32-HLQFP -40 to 85
Datasheets
40-W Mono Class-D Audio Power Amplifier datasheet
PDF, 1.5 Mb, Revision: C, File published: Aug 19, 2010
Extract from the document
Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
Packaging
| Pin | 32 |
| Package Type | VFP |
| Industry STD Term | HLQFP |
| JEDEC Code | S-PQFP-G |
| Package QTY | 250 |
| Carrier | JEDEC TRAY (10+1) |
| Device Marking | TPA3106D1 |
| Width (mm) | 7 |
| Length (mm) | 7 |
| Thickness (mm) | 1.4 |
| Pitch (mm) | .8 |
| Max Height (mm) | 1.6 |
| Mechanical Data | Download |
Parametrics
| Analog Supply (V) | 26 Min |
| Audio Input Type | Analog |
| Closed/Open Loop | Closed |
| Control Interface | Hardware |
| Operating Temperature Range | -40 to 85 C |
| Package Group | HLQFP |
| Package Size: mm2:W x L | 32HLQFP: 81 mm2: 9 x 9(HLQFP) PKG |
| Power Stage Supply(Max) | 26 V |
| Power Stage Supply(Min) | 10 V |
| Power to Bridge Tied Load(Max) | 40 W |
| Rating | Catalog |
| Speaker Channels | 1 Max |
| Supported Bridge Tied Load(Min) | 4 Ohms |
Eco Plan
| RoHS | Compliant |
Design Kits & Evaluation Modules
- Evaluation Modules & Boards: TPA3106D1EVM
TPA3106D1 Evaluation Module (EVM)
Lifecycle Status: Active (Recommended for new designs)
Application Notes
- Interfacing External Devices to the TPA310xDx AmplifiersPDF, 105 Kb, File published: Sep 29, 2008
TPA310xDx Logic Pin Interface - AN-1737 Managing EMI in Class D Audio Applications (Rev. A)PDF, 140 Kb, Revision: A, File published: May 1, 2013
Electromagnetic interference (EMI) is an unwanted disturbance caused in an electrical circuit byelectromagnetic radiation emitted from an external source. The disturbance may interrupt, obstruct, orotherwise degrade the effective performance of the circuit. - Using Thermal Calculation Tools for Analog ComponentsPDF, 1.1 Mb, File published: Sep 2, 2010
This document provides general guidance on the use of toolsand calculations for thermal estimates of component operating temperatures for analog devices. Of particularfocus are components with direct thermal paths to the PCB which is common for components which need a low thermal resistance to manage the dissipated power. This document provides practical considerations for estimation of o - AN-1849 An Audio Amplifier Power Supply Design (Rev. B)PDF, 1.9 Mb, Revision: B, File published: May 1, 2013
This application report provides design information for a power supply for use with our newest offering of high-performance, ultra high-fidelity audio amplifier input stage ICs. - Guidelines for Measuring Audio Power Amplifier PerformancePDF, 765 Kb, File published: Oct 30, 2001
This application note provides guidelines for measuring the date sheet parameters of Texas Instruments audio power amplifiers (APAs) using prefabricated evaluation modules (EVMs). The primary equipment used for the measurements consists of the System Two audio measurement system by Audio Precision , a digital multimeter (DMM), and a dc power supply.
Model Line
Series: TPA3106D1 (3)
- TPA3106D1VFP TPA3106D1VFPG4 TPA3106D1VFPR
Manufacturer's Classification
- Semiconductors > Audio > Mid-Power Audio Amplifiers (10-50W) > Analog Input Amplifiers
