PDF, 742 Kb, Revision: B, File published: May 3, 2004
Application Note 643 EMI/RFI Board Design
PDF, 219 Kb, File published: Sep 19, 2005
PDF, 3.6 Mb, Revision: A, File published: Apr 23, 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
PDF, 1.4 Mb, Revision: A, File published: Apr 23, 2013
This application note provides thermal power analysis techniques for analyzing the power IC.
PDF, 2.7 Mb, Revision: A, File published: Apr 23, 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
PDF, 201 Kb, Revision: C, File published: Apr 19, 2016
PDF, 245 Kb, File published: Feb 17, 2003
PDF, 82 Kb, Revision: C, File published: Apr 23, 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
PDF, 374 Kb, Revision: C, File published: Apr 23, 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
PDF, 2.5 Mb, Revision: C, File published: Apr 24, 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
PDF, 601 Kb, Revision: D, File published: Apr 23, 2013
This application note provides information on the LM2825 application.
PDF, 9.2 Mb, Revision: B, File published: Apr 23, 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP