Datasheet Texas Instruments AM5718

Manufacturer	Texas Instruments
Series	AM5718

Datasheets

Prices

Status

Packaging

Parametrics

Parameters / Models	AM5718AABCX	AM5718AABCXA	AM5718AABCXEA	AM5718AABCXEQ1	AM5718AABCXQ1	XAM5718AABCXEA	XAM5718ABCXE
ARM CPU	1 ARM Cortex-A15	1 ARM Cortex-A15	1 ARM Cortex-A15	1 ARM Cortex-A15	1 ARM Cortex-A15	1 ARM Cortex-A15	1 ARM Cortex-A15
ARM MHz, Max.	1500	1500	1500	1500	1500		1500
ARM MHz (Max.)						1500
ARM MIPS, Max.	5250	5250	5250	5250	5250		5250
ARM MIPS(Max.)						5250
Application	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment Enterprise Systems Industrial Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics
Approx. Price (US$)						30.05 | 1ku
CAN	2	2	2	2	2		2
CAN(#)						2
CSI-2	2	2	2	2	2	2	2
Co-Processor, s	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS		2 ARM Cortex-M4,4 PRU-ICSS
Co-Processor(s)						2 ARM Cortex-M4 4 PRU-ICSS
DMA, Ch	64-Ch EDMA	64-Ch EDMA	64-Ch EDMA	64-Ch EDMA	64-Ch EDMA		64-Ch EDMA
DMA(Ch)						64-Ch EDMA
DRAM	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L	DDR3(L)	DDR3,DDR3L
DSP	1 C66x	1 C66x	1 C66x	1 C66x	1 C66x	1 C66x	1 C66x
DSP MHz, Max.	750	750	750	750	750		750
DSP MHz (Max.)						750
Display Options	1 HDMI out,3 LCD out	1 HDMI out,3 LCD out	1 HDMI out,3 LCD out	1 HDMI out,3 LCD out	1 HDMI out,3 LCD out	1 HDMI out 3 LCD out	1 HDMI out,3 LCD out
EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000 2-Port 1Gb Switch	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC
General Purpose Memory	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC NAND flash NOR Flash SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)
Graphics Acceleration	1 3D,1 2D	1 3D,1 2D	1 3D,1 2D	1 3D,1 2D	1 3D,1 2D	1 3D 1 2D	1 3D,1 2D
HDMI	1	1	1	1	1	1	1
I2C	5	5	5	5	5	5	5
IO Supply, V	1.8,3.3	1.8,3.3	1.8,3.3	1.8,3.3	1.8,3.3		1.8,3.3
IO Supply(V)						1.8 3.3
Industrial Protocols	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588 EtherCAT EtherNet/IP POWERLINK PROFIBUS PROFINET RT/IRT SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III
LCD	3	3	3	3	3	3	3
MMC/SD	4	4	4	4	4	4	4
McASP	8	8	8	8	8	8	8
On-Chip L1 Cache	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32 KB (ARM Cortex-A15) 32 KB (C66x)	32KB (L1D and L1I ARM Cortex-A15)
On-Chip L2 Cache	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15) 288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)
Operating Systems	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android Integrity Linux Nucleus Neutrino TI-RTOS VxWorks Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE
Operating Temperature Range, C	-40 to 105,-40 to 125,0 to 90	-40 to 105,-40 to 125,0 to 90	-40 to 105,-40 to 125,0 to 90	-40 to 105,-40 to 125,0 to 90	-40 to 105,-40 to 125,0 to 90		-40 to 105,-40 to 125,0 to 90
Operating Temperature Range(C)						-40 to 105 0 to 90
Other Hardware Acceleration	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator
Other On-Chip Memory	512 KB w/ECC	512 KB w/ECC	512 KB w/ECC	512 KB w/ECC	512 KB w/ECC	512 KB w/ECC	512 KB w/ECC
PCI/PCIe	2 PCIe	2 PCIe	2 PCIe	2 PCIe	2 PCIe	2 PCIe	2 PCIe
PWM, Ch	3	3	3	3	3		3
PWM(Ch)						3
Package Group	FCBGA	FCBGA	FCBGA	FCBGA	FCBGA	FCBGA	FCBGA
QSPI	1	1	1	1	1	1	1
RTC	1	1	1	1	1	1	1
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
SATA	1	1	1	1	1	1	1
SPI	4	4	4	4	4	4	4
Security Enabler						Cryptographic Acceleration Debug Security Device Identity External Memory Protection Initial Secure Programming Physical Security Secure Boot Secure Storage Software IP Protection Trusted Execution Environment
Serial I/O	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN I2C SPI UART USB	CAN,I2C,SPI,UART,USB
UART, SCI	10	10	10	10	10		10
UART(SCI)						10
USB	2	2	2	2	2	2	2
USB 2.0	1	1	1	1	1	1	1
USB 3.0	1	1	1	1	1	1	1
Video Port, Configurable	6+	6+	6+	6+	6+		6+
Video Port (Configurable)						6+
Video Resolution/Frame Rate	1080p60	1080p60	1080p60	1080p60	1080p60	1080p60	1080p60
eCAP	3	3	3	3	3	3	3
eQEP	3	3	3	3	3	3	3

Eco Plan

Application Notes

• Download
  DSPLIB for Processor SDK RTOS
  PDF, 461 Kb, File published: Nov 4, 2016
• Download
  AM572x GP EVM Power Simulations
  PDF, 22.4 Mb, File published: Oct 8, 2015
  The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target
• Download
  IODELAY Application Note for AM57xx Devices (Rev. A)
  PDF, 785 Kb, Revision: A, File published: Aug 3, 2017
• Download
  Code Composer Studio Device Support Package
  PDF, 87 Kb, File published: Nov 19, 2015
  This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
• Download
  AM572x/AM571x Compatibility Guide (Rev. C)
  PDF, 182 Kb, Revision: C, File published: Feb 22, 2016
  This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
• Download
  AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
  PDF, 55 Kb, File published: Oct 6, 2016
  When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
• Download
  EMIF Tools (Rev. A)
  PDF, 207 Kb, Revision: A, File published: Jun 5, 2017
  At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
• Download
  Keystone EDMA FAQ
  PDF, 1.3 Mb, File published: Sep 1, 2016
  This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
• Download
  AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
  PDF, 2.2 Mb, Revision: A, File published: May 1, 2004
  Application Note 1281 Bumped Die (Flip Chip) Packages
• Download
  TI DSP Benchmarking
  PDF, 62 Kb, File published: Jan 13, 2016
  This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
• Download
  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Kb, Revision: A, File published: Aug 17, 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
• Download
  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Mb, Revision: B, File published: Aug 13, 2015
• Download
  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Kb, Revision: G, File published: Jul 27, 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Model Line

Manufacturer's Classification

• Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x