Datasheet Texas Instruments CD40105B-MIL

Manufacturer	Texas Instruments
Series	CD40105B-MIL

CMOS 4-Bit-by-16-Word FIFO Register

Datasheets

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PDF, 445 Kb, File published: Nov 21, 1998

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Data sheet acquired from Harris Semiconductor
SCHS096 PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009 PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package Eco Plan (2)
Qty CD40105BE ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type CD40105BEE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type CD40105BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD40105BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD40105BF3AS2283 OBSOLETE CDIP J 16 TBD Call TI Lead/Ball Finish MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan -The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) -please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS …

Status

	CD40105BF	CD40105BF3A
Lifecycle Status	Active (Recommended for new designs)	Active (Recommended for new designs)
Manufacture's Sample Availability	No	No

Packaging

	CD40105BF	CD40105BF3A
N	1	2
Pin	16	16
Package Type	J	J
Industry STD Term	CDIP	CDIP
JEDEC Code	R-GDIP-T	R-GDIP-T
Package QTY	1	1
Carrier	TUBE	TUBE
Device Marking	CD40105BF	CD40105BF3A
Width (mm)	6.92	6.92
Length (mm)	19.56	19.56
Thickness (mm)	4.57	4.57
Pitch (mm)	2.54	2.54
Max Height (mm)	5.08	5.08
Mechanical Data	Download	Download

Eco Plan

	CD40105BF	CD40105BF3A
RoHS	See ti.com	See ti.com

Application Notes

Download
Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics
PDF, 188 Kb, File published: Dec 3, 2001
Both buffered and unbuffered CMOS B-series gates inverters and high-current IC products are available from TI. Each product classification has application advantages in appropriate logic-system designs. Many CMOS suppliers have concentrated on promoting buffered B-series products with applications literature focusing on the attributes and use of the buffered types. This practice has left an imb

Model Line

Series: CD40105B-MIL (2)

CD40105BF CD40105BF3A

Manufacturer's Classification

Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers