Datasheet Texas Instruments ISO7342-Q1

Manufacturer	Texas Instruments
Series	ISO7342-Q1

Automotive, Low Power, Quad-Channel 2/2 Digital Isolator

Datasheets

PDF, 1.2 Mb, Revision: B, File published: May 30, 2017

Extract from the document

	ISO7342CQDWQ1	ISO7342CQDWRQ1	ISO7342FCQDWQ1	ISO7342FCQDWRQ1
Lifecycle Status	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)
Manufacture's Sample Availability	Yes	No	No	Yes

	ISO7342CQDWQ1	ISO7342CQDWRQ1	ISO7342FCQDWQ1	ISO7342FCQDWRQ1
N	1	2	3	4
Pin	16	16	16	16
Package Type	DW	DW	DW	DW
Industry STD Term	SOIC	SOIC	SOIC	SOIC
JEDEC Code	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G
Package QTY	40	2000	40	2000
Carrier	TUBE	LARGE T&R	TUBE	LARGE T&R
Device Marking	ISO7342CQ	ISO7342CQ	ISO7342FCQ	ISO7342FCQ
Width (mm)	7.5	7.5	7.5	7.5
Length (mm)	10.3	10.3	10.3	10.3
Thickness (mm)	2.35	2.35	2.35	2.35
Pitch (mm)	1.27	1.27	1.27	1.27
Max Height (mm)	2.65	2.65	2.65	2.65
Mechanical Data	Download	Download	Download	Download

Parameters / Models	ISO7342CQDWQ1	ISO7342CQDWRQ1	ISO7342FCQDWQ1	ISO7342FCQDWRQ1
Data Rate(Max), Mbps	25	25	25	25
Default Output	High	High	Low	Low
Forward/Reverse Channels	2/2	2/2	2/2	2/2
Integrated Isolated Power	No	No	No	No
Isolation Rating, Vrms	3000	3000	3000	3000
Number of Channels	4	4	4	4
Operating Temperature Range, C	-40 to 125	-40 to 125	-40 to 125	-40 to 125
Package Group	SOIC	SOIC	SOIC	SOIC
Package Size: mm2:W x L, PKG	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)	16SOIC: 106 mm2: 10.3 x 10.3(SOIC)
Propagation Delay, ns	31	31	31	31
Propagation Delay(Typ), ns	31	31	31	31
Rating	Automotive	Automotive	Automotive	Automotive
Surge Voltage Rating, Vpk	6000	6000	6000	6000
VCC(Max), V	5	5	5	5
VCC(Min), V	3.3	3.3	3.3	3.3

	ISO7342CQDWQ1	ISO7342CQDWRQ1	ISO7342FCQDWQ1	ISO7342FCQDWRQ1
RoHS	Compliant	Compliant	Compliant	Compliant

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The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a
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Series: ISO7342-Q1 (4)