Datasheet Texas Instruments LMZ31520

Manufacturer	Texas Instruments
Series	LMZ31520

Datasheets

Prices

Status

Packaging

Parametrics

Parameters / Models	LMZ31520RLGT
Iout(Max), A	20
Operating Temperature Range, C	-40 to 85
Package Size: mm2:W x L, PKG	72BQFN: 240 mm2: 15 x 16(BQFN)
Package Type	QFN
Regulated Outputs	1
Soft Start	Adjustable
Special Features	EMI Tested,Enable,Light Load Efficiency,Power Good,Remote Sense
Switching Frequency(Max), kHz	850
Switching Frequency(Min), kHz	300
Switching Frequency(Typ), kHz	500
Vin(Max), V	14.5
Vin(Min), V	3
Vout(Max), V	3.6
Vout(Min), V	0.6

Eco Plan

Application Notes

• Download
  Powering LMZ3 SIMPLE SWITCHER Power Modules From 3.3 V
  PDF, 38 Kb, File published: Jul 2, 2013
  LMZ31503 Powering LMZ3 SIMPLE SWITCHERВ® Power Modules from 3.3V
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  Working With QFN Power Modules (Rev. A)
  PDF, 1.7 Mb, Revision: A, File published: Jun 8, 2017
  TexasInstrumentsQuadFlatpackNo-lead(QFN)powermodulesallowfor boardminiaturization,and holdseveraladvantagesoverotherpowermodulepackages.The QFNpackageshavehigherpowerdensity,asmallerroutingarea,improvedthermalperformance,and improvedelectricalparasitics.Additionally,theabsenceof externalleadseliminatesbent-leadconc
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  Soldering Requirements for BQFN Packages (Rev. B)
  PDF, 737 Kb, Revision: B, File published: Jun 8, 2017
  This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
• Download
  Uninterruptible Synchronization Clock Circuit
  PDF, 74 Kb, File published: Nov 22, 2013
• Download
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revision: B, File published: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
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  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revision: A, File published: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
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  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revision: C, File published: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
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  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revision: C, File published: Apr 19, 2016
• Download
  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Kb, Revision: B, File published: Aug 24, 2018
• Download
  Input and Output Capacitor Selection
  PDF, 219 Kb, File published: Sep 19, 2005

Model Line

Manufacturer's Classification

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module