Datasheet Texas Instruments LMZ35003

Manufacturer	Texas Instruments
Series	LMZ35003

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Packaging

Parametrics

Parameters / Models	LMZ35003RKGR	LMZ35003RKGT
Iout(Max), A	2.5	2.5
Operating Temperature Range, C	-40 to 85	-40 to 85
Package Size: mm2:W x L, PKG	41B1QFN: 99 mm2: 9 x 11(B1QFN)	41B1QFN: 99 mm2: 9 x 11(B1QFN)
Package Type	QFN	QFN
Regulated Outputs	1	1
Soft Start	Adjustable	Adjustable
Special Features	EMI Tested,Enable,Frequency Synchronization,Power Good,Remote Sense,Tracking	EMI Tested,Enable,Frequency Synchronization,Power Good,Remote Sense,Tracking
Switching Frequency(Max), kHz	1000	1000
Switching Frequency(Min), kHz	300	300
Switching Frequency(Typ), kHz	400	400
Vin(Max), V	50	50
Vin(Min), V	7	7
Vout(Max), V	15	15
Vout(Min), V	2.5	2.5

Eco Plan

Application Notes

• Download
  LMZ35003 Protects Against 60-V Line Transients
  PDF, 27 Kb, File published: Jun 18, 2015
  The LMZ35003, wide input voltage, 2.5-A Simple SwitcherВ® power module is designed for typicaloperating input voltages of 7 V to 50 V. However, with a 65-V absolute maximum input voltage rating, theLMZ35003 can be used in applications where the input voltage exceeds 50 V during line transients. The 7V to 50 V operating input voltage range of the LMZ35003 is recommended for the best performanc
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  LMZ35003 Parallel Operation
  PDF, 218 Kb, File published: May 28, 2014
  The LMZ35003 is a 7-V to 50-V input, 2.5-A output, integrated power module which integrates a DC/DCconverter, shielded inductor and passives in a low-profile, QFN package. For applications requiring greaterthan 2.5 A, it is possible to parallel multiple LMZ35003 devices by following the recommendations in thispaper.
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  Power Module MSL Ratings
  PDF, 137 Kb, File published: Jan 20, 2017
  All semiconductor devices, including power modules that have a moisture sensitivity level (MSL) rating and a peak reflow classification, which provides needed information when manufacturing with the device. This application report helps to explain these ratings.
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  Working With QFN Power Modules (Rev. A)
  PDF, 1.7 Mb, Revision: A, File published: Jun 8, 2017
  TexasInstrumentsQuadFlatpackNo-lead(QFN)powermodulesallowfor boardminiaturization,and holdseveraladvantagesoverotherpowermodulepackages.The QFNpackageshavehigherpowerdensity,asmallerroutingarea,improvedthermalperformance,and improvedelectricalparasitics.Additionally,theabsenceof externalleadseliminatesbent-leadconc
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  Soldering Requirements for BQFN Packages (Rev. B)
  PDF, 737 Kb, Revision: B, File published: Jun 8, 2017
  This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
• Download
  Uninterruptible Synchronization Clock Circuit
  PDF, 74 Kb, File published: Nov 22, 2013
• Download
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revision: B, File published: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
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  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revision: A, File published: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
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  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revision: C, File published: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
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  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Kb, Revision: B, File published: Aug 24, 2018
• Download
  Input and Output Capacitor Selection
  PDF, 219 Kb, File published: Sep 19, 2005

Model Line

Manufacturer's Classification

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module