Datasheet Texas Instruments SN54BCT8240A

ManufacturerTexas Instruments
SeriesSN54BCT8240A
Datasheet Texas Instruments SN54BCT8240A

Scan Test Devices With Octal Buffers

Datasheets

Scan Test Devices With Octal Inverting Buffers datasheet
PDF, 424 Kb, Revision: E, File published: Dec 1, 1996
Extract from the document

Prices

Status

5962-9174601Q3A5962-9174601QLASNJ54BCT8240AFKSNJ54BCT8240AJT
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNo

Packaging

5962-9174601Q3A5962-9174601QLASNJ54BCT8240AFKSNJ54BCT8240AJT
N1234
Pin28242824
Package TypeFKJTFKJT
Industry STD TermLCCCCDIPLCCCCDIP
JEDEC CodeS-CQCC-NR-GDIP-TS-CQCC-NR-GDIP-T
Package QTY1111
CarrierTUBETUBETUBETUBE
Width (mm)11.436.9211.436.92
Length (mm)11.433211.4332
Thickness (mm)1.834.71.834.7
Pitch (mm)1.272.541.272.54
Max Height (mm)2.035.082.035.08
Mechanical DataDownloadDownloadDownloadDownload
Device Marking5962-SNJ54BCT8240AJ

Parametrics

Parameters / Models5962-9174601Q3A
5962-9174601Q3A
5962-9174601QLA
5962-9174601QLA
SNJ54BCT8240AFK
SNJ54BCT8240AFK
SNJ54BCT8240AJT
SNJ54BCT8240AJT
Bits8888
ICC @ Nom Voltage(Max), mA52525252
Input TypeTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125
Output Drive (IOL/IOH)(Max), mA64/-1564/-1564/-1564/-15
Output TypeTTLTTLTTLTTL
Package GroupLCCCCDIPLCCCCDIP
Package Size: mm2:W x L, PKG28LCCC: 131 mm2: 11.43 x 11.43(LCCC)See datasheet (CDIP)28LCCC: 131 mm2: 11.43 x 11.43(LCCC)See datasheet (CDIP)
RatingMilitaryMilitaryMilitaryMilitary
Technology FamilyBCTBCTBCTBCT
VCC(Max), V5.55.55.55.5
VCC(Min), V4.54.54.54.5
tpd @ Nom Voltage(Max), ns9999

Eco Plan

5962-9174601Q3A5962-9174601QLASNJ54BCT8240AFKSNJ54BCT8240AJT
RoHSSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, File published: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, File published: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Live Insertion
    PDF, 150 Kb, File published: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revision: D, File published: Jun 23, 2016

Model Line

Manufacturer's Classification

  • Semiconductors> Space & High Reliability> Logic Products> Specialty Logic Products> Boundary Scan (JTAG)
EMS supplier