Datasheet Texas Instruments SN54F283

Manufacturer	Texas Instruments
Series	SN54F283

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Parametrics

Parameters / Models	5962-9758701Q2A	5962-9758701QEA	5962-9758701QFA	JM38510/34201B2A	JM38510/34201BEA	JM38510/34201BFA	M38510/34201B2A	M38510/34201BEA	M38510/34201BFA	SN54F283J	SNJ54F283FK	SNJ54F283J	SNJ54F283W
Bits	4	4		4	4	4	4	4	4	4	4	4
Bits(#)			4										4
F @ Nom Voltage(Max), Mhz	70	70		70	70	70	70	70	70	70	70	70
F @ Nom Voltage(Max)(Mhz)			70										70
Function	Arithmetic	Arithmetic	Arithmetic	Arithmetic	Arithmetic	Arithmetic	Arithmetic	Arithmetic	Arithmetic	Arithmetic	Arithmetic	Arithmetic	Arithmetic
ICC @ Nom Voltage(Max), mA	55	55		55	55	55	55	55	55	55	55	55
ICC @ Nom Voltage(Max)(mA)			55										55
Operating Temperature Range, C	-55 to 125	-55 to 125		-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125
Operating Temperature Range(C)			-55 to 125										-55 to 125
Output Drive (IOL/IOH)(Max), mA	20/-1	20/-1		20/-1	20/-1	20/-1	20/-1	20/-1	20/-1	20/-1	20/-1	20/-1
Output Drive (IOL/IOH)(Max)(mA)			20/-1										20/-1
Package Group	LCCC	CDIP	CFP	LCCC	CDIP	CFP	LCCC	CDIP	CFP	CDIP	LCCC	CDIP	CFP
Package Size: mm2:W x L, PKG	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)		20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)	See datasheet (CDIP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)
Package Size: mm2:W x L (PKG)			See datasheet (CFP)										See datasheet (CFP)
Rating	Military	Military	Military	Military	Military	Military	Military	Military	Military	Military	Military	Military	Military
Technology Family	F	F	F	F	F	F	F	F	F	F	F	F	F
Type	Binary	Binary	Binary	Binary	Binary	Binary	Binary	Binary	Binary	Binary	Binary	Binary	Binary
VCC(Max), V	5.5	5.5		5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5
VCC(Max)(V)			5.5										5.5
VCC(Min), V	4.5	4.5		4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5
VCC(Min)(V)			4.5										4.5
tpd @ Nom Voltage(Max), ns	10.5	10.5		10.5	10.5	10.5	10.5	10.5	10.5	10.5	10.5	10.5
tpd @ Nom Voltage(Max)(ns)			10.5										10.5

Eco Plan

Application Notes

• Download
  Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
  PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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  Input and Output Characteristics of Digital Integrated Circuits
  PDF, 1.7 Mb, File published: Oct 1, 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
• Download
  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, File published: Aug 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
• Download
  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, File published: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
• Download
  Designing With Logic (Rev. C)
  PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
• Download
  Introduction to Logic
  PDF, 93 Kb, File published: Apr 30, 2015
• Download
  Shelf-Life Evaluation of Lead-Free Component Finishes
  PDF, 1.3 Mb, File published: May 24, 2004
  The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

Model Line

Manufacturer's Classification

• Semiconductors> Space & High Reliability> Logic Products> Specialty Logic Products> Counter/Arithmetic/Parity Function Products