Datasheet Texas Instruments TMS320VC5510A

ManufacturerTexas Instruments
SeriesTMS320VC5510A
Datasheet Texas Instruments TMS320VC5510A

Fixed-Point Digital Signal Processors

Datasheets

TMS320VC5510/5510A Fixed-Point Digital Signal Processors datasheet
PDF, 1.3 Mb, Revision: O, File published: Sep 24, 2007
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Prices

Status

TMS320SP103AZGW2TMS320VC5510AGGW1TMS320VC5510AGGW2TMS320VC5510AGGWA1TMS320VC5510AGGWA2TMS320VC5510AZGW1TMS320VC5510AZGW2TMS320VC5510AZGWA1TMS320VC5510AZGWA2
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNoNoYes

Packaging

TMS320SP103AZGW2TMS320VC5510AGGW1TMS320VC5510AGGW2TMS320VC5510AGGWA1TMS320VC5510AGGWA2TMS320VC5510AZGW1TMS320VC5510AZGW2TMS320VC5510AZGWA1TMS320VC5510AZGWA2
N123456789
Pin240240240240240240240240240
Package TypeZGWGGWGGWGGWGGWZGWZGWZGWZGW
Industry STD TermBGA MICROSTARBGA MICROSTARBGA MICROSTARBGA MICROSTARBGA MICROSTARBGA MICROSTARBGA MICROSTARBGA MICROSTARBGA MICROSTAR
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-N
Package QTY1261126126126126126126126
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device MarkingVC5510AZGW2VC5510AGGW1VC5510AGGW2TMS320TMS320VC5510AZGW1TMS320VC5510AZGWA1VC5510AZGWA2
Width (mm)151515151515151515
Length (mm)151515151515151515
Thickness (mm).9.9.9.9.9.9.9.9.9
Pitch (mm).8.8.8.8.8.8.8.8.8
Max Height (mm)1.41.41.41.41.41.41.41.41.4
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / ModelsTMS320SP103AZGW2
TMS320SP103AZGW2
TMS320VC5510AGGW1
TMS320VC5510AGGW1
TMS320VC5510AGGW2
TMS320VC5510AGGW2
TMS320VC5510AGGWA1
TMS320VC5510AGGWA1
TMS320VC5510AGGWA2
TMS320VC5510AGGWA2
TMS320VC5510AZGW1
TMS320VC5510AZGW1
TMS320VC5510AZGW2
TMS320VC5510AZGW2
TMS320VC5510AZGWA1
TMS320VC5510AZGWA1
TMS320VC5510AZGWA2
TMS320VC5510AZGWA2
ApplicationsAudio,Automotive,Communications and Telecom,Consumer Electronics,IndustrialAudio,Automotive,Communications and Telecom,Consumer Electronics,IndustrialAudio,Automotive,Communications and Telecom,Consumer Electronics,IndustrialAudio,Automotive,Communications and Telecom,Consumer Electronics,IndustrialAudio,Automotive,Communications and Telecom,Consumer Electronics,IndustrialAudio,Automotive,Communications and Telecom,Consumer Electronics,IndustrialAudio,Automotive,Communications and Telecom,Consumer Electronics,IndustrialAudio,Automotive,Communications and Telecom,Consumer Electronics,IndustrialAudio,Automotive,Communications and Telecom,Consumer Electronics,Industrial
DRAMSDRAMSDRAMSDRAMSDRAMSDRAMSDRAMSDRAMSDRAMSDRAM
DSP1 C55x1 C55x1 C55x1 C55x1 C55x1 C55x1 C55x1 C55x1 C55x
DSP MHz, Max.160,200160,200160,200160,200160,200160,200160,200160,200160,200
HPI1 16-bit HPI1 16-bit HPI1 16-bit HPI1 16-bit HPI1 16-bit HPI1 16-bit HPI1 16-bit HPI1 16-bit HPI1 16-bit HPI
McBSP333333333
Operating SystemsDSP/BIOS,VLXDSP/BIOS,VLXDSP/BIOS,VLXDSP/BIOS,VLXDSP/BIOS,VLXDSP/BIOS,VLXDSP/BIOS,VLXDSP/BIOS,VLXDSP/BIOS,VLX
Operating Temperature Range, C-40 to 85,0 to 85-40 to 85,0 to 85-40 to 85,0 to 85-40 to 85,0 to 85-40 to 85,0 to 85-40 to 85,0 to 85-40 to 85,0 to 85-40 to 85,0 to 85-40 to 85,0 to 85
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog

Eco Plan

TMS320SP103AZGW2TMS320VC5510AGGW1TMS320VC5510AGGW2TMS320VC5510AGGWA1TMS320VC5510AGGWA2TMS320VC5510AZGW1TMS320VC5510AZGW2TMS320VC5510AZGWA1TMS320VC5510AZGWA2
RoHSCompliantSee ti.comSee ti.comSee ti.comSee ti.comCompliantCompliantCompliantCompliant

Application Notes

  • Using the Power Scaling Library (Rev. A)
    PDF, 402 Kb, Revision: A, File published: Sep 30, 2004
    Power consumption is a key concern for embedded system developers. By developing low-power solutions, developers can deliver products that have longer battery life. One technique that can be used to save power is frequency and voltage scaling of the processor.Since the power consumption of a DSP is proportional to the system clock switching speed, running the device at the lowest possible fre
  • Interfacing TMS320VC5510 to SBSRAM (Rev. A)
    PDF, 140 Kb, Revision: A, File published: Jun 16, 2003
    The TMS320C55xв„ў(C55xв„ў) External Memory Interface (EMIF) supports a glueless interface to high-density and high-speed synchronous burst static random access memories (SBSRAM). For clocking SBSRAMs, the EMIF can operate at numerous C55x DSP CPU clock output frequency multiples. Examples are given for system-level connection and register configuration for the different types of SBSRAM mem
  • Using the TMS320VC5510 Bootloader (Rev. C)
    PDF, 269 Kb, Revision: C, File published: Oct 19, 2004
    This document describes the features of the on-chip bootloader provided with the TMS320VC5510 Digital Signal Processor (DSP). Included are descriptions of each of the available boot modes and any interfacing requirements associated with them, instructions on generating the boot table, and information on migration from the prototype (TMX320VC5510, revision 1.x) to the production (TMS320VC5510) boot
  • TMS320VC5510/5510A Hardware Designer's Resource Guide (Rev. A)
    PDF, 100 Kb, Revision: A, File published: Apr 20, 2005
    The DSP Hardware Designer's Resource Guide is organized by development flow and functional areas to make your design effort as seamless as possible. Topics covered include getting started, board design, system testing, and checklists to aid in your initial design and debug efforts. Each section includes pointers to valuable information including technical documentation, models, symbols, and refer
  • TMS320VC5510 HPI Throughput and Optimization
    PDF, 83 Kb, File published: May 27, 2004
    This application report summarizes some characteristics relevant to understanding TMS320VC5510 host port interface (HPI), and proposes recommendations to optimize throughput on the HPI peripheral.
  • TMS320VC5510 Power Consumption Summary
    PDF, 78 Kb, File published: Nov 12, 2003
    This document assists in the estimation of power consumption for the TMS320C5510 digital signal processor (DSP). As power consumption can vary widely on this device, a spreadsheet was developed to provide a better estimate. This allows the user to tailor the prediction to their particular application. It also allows designers the ability to test the efficiency of different configurations before an
  • Seismic Sensor Demonstration Using an ADS1255 and TMS320VC5510A DSP (Rev. A)
    PDF, 193 Kb, Revision: A, File published: Jan 29, 2009
    A prototype system for seismic sensing for such applications as oil exploration, earthquake detection, and acoustic monitoring is described. The system uses a delta-sigma converter and low-power DSP. Measured system performance met the requirements for such systems.
  • Migrating from TMS320VC5510 to TMS320VC5502
    PDF, 187 Kb, File published: Feb 28, 2003
    This document describes issues of interest related to migration from the TMS320VC5510 to the TMS320VC5502. The objective of this document is to indicate differences between the two devices. Functions that are identical between the two devices are not included. For detailed information on the specific functions of either device, refer to the following data manuals and reference guides: the TMS320VC

Model Line

Manufacturer's Classification

  • Semiconductors> Processors> Digital Signal Processors> C5000 DSP> C55x DSP
EMS supplier