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Package Intersil MDP0047

ManufacturerIntersil
SeriesDFN
Part NumberMDP0047

Dual Flat No-Lead (DFN) Package Family

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Dual Flat No-Lead Package Family (DFN)
    MDP0047 A DUAL FLAT NO-LEAD PACKAGE FAMILY (JEDEC REG: MO-229) D MILLIMETERS N N-1
    0.075 C
    2X
    PIN #1
    I.D. E 1 2
    0.075 C B 2X TOP VIEW (D2) 4
    L1 N-1 N
    L (N LEADS) SYMBOL DFN8 DFN10 TOLERANCE A 0.85 0.90 В±0.10 A1 0.02 0.02 +0.03/-0.02 b 0.30 0.25 В±0.05 c 0.20 0.20 Reference D 4.00 3.00 Basic D2 3.00 2.25 В±0.05 E 4.00 3.00 Basic E2 2.20 1.50 В±0.05 e 0.80 0.50 Basic L 0.50 0.50 В±0.10 L1 0.10 0 Maximum
    Rev. 4 1/16 NOTES: (E2) 1. Dimensioning and tolerancing per ASME Y14.5M-1994.
    PIN #1 I.D.
    1 2 5 e b 0.10 M C A B C 6. N is the total number of leads on the device. SEATING
    PLANE
    C SEE DETAIL "X" (N LEADS
    & EXPOSED PAD) 2
    C
    A 3. Bottom-side pin #1 I.D. may be a diepad chamfer, an extended
    tiebar tab, or a small square as shown. 5. Inward end of lead may be square or circular in shape with radius
    (b/2) as shown. C 0.08 2. Tiebar shown (if present) is a non-functional feature and may be
    located on any of the 4 sides (or ends). 4. Exposed leads may extend to the edge of the package or be
    pulled back. See dimension “L1”. BOTTOM VIEW 0.10 3 (c) A1
    DETAIL X 1 ...

Parametrics

FamilyDFN
Thickness0.90 mm
Height max1.00 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexMDP0047

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages

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