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Package Intersil Q128.14x14A

Package Intersil Q128.14x14A

ManufacturerIntersil
SeriesLQFP
Part NumberQ128.14x14A

128 Lead Low Plastic Quad Flatpack Exposed Pad Package (0.4mm pitch) (LQFP-EP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Low Plastic Quad Flatpack Exposed Pad Package (LQFP-EP)
    4X Q128.14x14A 0.2 YT-U Z 128 Lead Low Plastic Quad Flatpack Exposed Pad Package
    (0.4mm pitch) D PIN 1
    128 97 Z 1 MILLIMETERS 96 SYMBOL U T
    E E1 32 65
    33
    4X NOM 0.2 HT-U Z A -1.60 0.05 -0.15 A2 1.35 1.40 1.45 b 0.13 0.18 0.23 b1 0.13 0.16 0.19 c 0.09 -0.20 c1 0.09 -0.16 14 BSC 3 E 16 BSC 4 14 BSC
    0.45 Y
    124X e
    SEATING PLANE 0.080 Y 0.07 YT-UZ
    b
    c
    PLATING c1
    b 3 0.60 L1 0.75 1.00 REF R1 128X b 4 D1 L H NOTES 16 BSC E1 DETAIL F MAX A1 D 64
    D1 MIN 0.08 -R2 0.08 -0.20 S 0.20 -θ 0° 3.5° 7.0° θ1 0° -θ2 11° 12° 13° θ3 11° 12° 13° e 0.40 BSC M 6.855 6.955 7.055 N 6.855 6.955 7.055
    Rev. 1 7/11 NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. N 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
    3. Dimensions D1 and E1 are excluding mold protrusion. Allowable
    protrusion is 0.25mm per side. Dimensions D1 and E1 are
    inclusive of mold mismatch and determined by datum plane H.
    4. Dimension b does not include dambar protrusion. Allowable ...

Parametrics

FamilyLQFP
Pin Count128
Length14.00 mm
Width14.00 mm
Thickness1.40 mm
Height max1.60 mm
Weight0.79 g
Pitch0.40 mm
Peak Temperature225 °C
Lead Free Peak Temperature260 °C
Package IndexQ128.14X14A

Moldel Line

Series: LQFP (19)

Manufacturer's Classification

  • Plastic Packages
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