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Package Intersil Q128.14x20B

Package Intersil Q128.14x20B

ManufacturerIntersil
SeriesLQFP
Part NumberQ128.14x20B

128 Lead Low Quad Flatpack with Top Exposed Pad (LQFP-TEP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Low Plastic Quad Flatpack Package with Top Exposed Pad (LQFP-TEP)
    Q128.14x20B 4
    D
    NOTE: EXPOSED PAD 128 Lead Low Quad Flatpack with Top Exposed Pad D/2
    D MILLIMETERS 3 BHB
    3 SYMBOL A
    B 3 D2 E 4 e
    E2 N/4 TIPS
    0.20 C A-B D 4X SEE DETAIL "A" TOP VIEW
    5 7
    D1/2 XX U NT RY E1/2
    5 -1.60 0.05 -0.15 A2 1.35 1.40 1.45 7
    E1 NOTES
    13 22 BSC 4 D1 20 BSC 7, 8 D2 12.20 BSC 14 E 16 BSC 4 E1 14 BSC 7, 8 L CO MAX A E2 D1 NOM A1
    D E/2 PIN 1 ID MIN 8.35 BSC
    0.45 0.60 N 128 e 0.50 BSC 14
    0.75 b 0.17 0.22 0.27 b1 0.17 0.20 0.23 ccc 0.08 ddd 0.08 9 Rev. 1 7/11
    4X NOTES: BOTTOM VIEW 0.20 H A-B D 1. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 8 PLACES
    11/13В° 2. Datum plane H located at mold parting line and coincident with
    lead, where lead exits plastic body at bottom of parting line. A
    2 H 0.05 / / 0.10 C ccc C 4. To be determined at seating plane C. SEE DETAIL "B" 5. Dimensions D1 and E1 do not include mold protrusion. Allowable
    protrusion is 0.254mm per side on D1 and E1 dimensions. ddd M C A-B S D S 9 WITH LEAD FINISH b 0.09/0.20 6. “N” is the total number of terminals. ...

Parametrics

FamilyLQFP-TEP
Pin Count128
Length20.00 mm
Width14.00 mm
Thickness1.40 mm
Height max1.60 mm
Weight0.9777 g
Pitch0.50 mm
Peak Temperature225 °C
Lead Free Peak Temperature260 °C
FeaturesTop Exposed Pad
Package IndexQ128.14X20B

Moldel Line

Series: LQFP (19)

Manufacturer's Classification

  • Plastic Packages
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