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Package Intersil Q128.14x20C

Package Intersil Q128.14x20C

ManufacturerIntersil
SeriesLQFP
Part NumberQ128.14x20C

128 Low Plastic Quad Flatpack Package With Top Exposed Pad (TEP-LQFP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    Q128.14x20C
    128 LOW PLASTIC QUAD FLATPACK PACKAGE WITH TOP EXPOSED PAD (TEP-LQFP)
    Rev 0, 4/10
    22.00
    4 5
    20.00 12.81 В±0.10
    D 3 3 A
    16.00
    B
    3
    8.38 В±0.10 0.50 4X 0.20 C A-B D 14.00 4 5 EXPOSED PAD PIN 1 ID 4X TOP VIEW 0.20 H A-B D BOTTOM VIEW 0В° MIN.
    1.60 MAX
    1.40 В±0.05 / / 0.10 C
    C SIDE VIEW 0.08 H 11/13В°
    0.05 0.05/0.15 SEE DETAIL "A" 2 0.08
    R. MIN.
    0.20 MIN. 0.25
    GAUGE PLANE
    0.60 В± 0.15
    0-7В° (1.00)
    DETAIL "A"
    SCALE: NONE (21.4) ...

Parametrics

FamilyLQFP-TEP
Pin Count128
Length20.00 mm
Width14.00 mm
Height max1.60 mm
Weight0.991 g
Pitch0.50 mm
Peak Temperature225 °C
Lead Free Peak Temperature260 °C
FeaturesTop Exposed Pad
Package IndexQ128.14X20C

Moldel Line

Series: LQFP (19)

Manufacturer's Classification

  • Plastic Packages
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