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Package Intersil Q156.14x20

ManufacturerIntersil
SeriesLQFP
Part NumberQ156.14x20

156 LD LOW PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE (0.4mm LD PITCH) (LQFP-EP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    Q156.14x20
    156 LEAD LOW PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE (0.4mm LEAD PITCH) (LQFP-EP)
    Rev 1, 10/16
    22.00 BSC
    20.00 BSC 1
    6.000 18.00
    -D-124 79 156 47 78 125 -B-A16.00
    BSC 46 1 (6.00) 14.00
    BSC 12.40
    1 156 125
    124 47
    1 46 0.40 BSC 0.20 C A-B D 4X
    4X +0.07
    2 0.16 -0.03 78
    79 EXPOSED
    PAD
    BOTTOM VIEW 0.20 H A-B D 0.08 M C A-B D TOP VIEW SEE
    DETAIL "X" 0В° MIN 3.5В° В±3.5В° 0.08 C 12В° В±1В°
    0.08 MIN -C-SEATING
    PLANE 0.08/0.20
    -HGAGE PLANE -0.05 0.09/0.20 S 1.60 MAX 0.25 0.20 MIN 1.40 В±0.05 12В° В±1В° 0.05/0.15 1.00 REF 0.60 В±0.15 DETAIL X'' SIDE VIEW (21.30)
    (6.00) NOTES: ...

Parametrics

FamilyLQFP
Pin Count156
Length20.00 mm
Width14.00 mm
Thickness1.40 mm
Height max1.60 mm
Weight0.936 g
Pitch0.41 mm
Peak Temperature220 °C
Lead Free Peak Temperature260 °C
Package IndexQ156.14X20

Moldel Line

Series: LQFP (19)

Manufacturer's Classification

  • Plastic Packages
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