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Package Intersil Q208.28x28D

ManufacturerIntersil
SeriesPQFP
Part NumberQ208.28x28D

208 Lead Plastic Quad Flatpack Package (PQFP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    Q208.28x28D
    208 LEAD PLASTIC QUAD FLATPACK PACKAGE (PQFP)
    Rev 0, 12/12
    MILLIMETERS D SYMBOL MIN NOM MAX MIN NOM MAX D2 A -4.10 -0.161 A1 0.25 -0.010 -A2 3.20 3.32 3.60 -D-E2 D 30.60 BSC
    28.00 BSC 1.102 BSC E 30.60 BSC 1.205 BSC 28.00 BSC
    -0.25 0.003 -R1 0.08 -0.003 -Оё 0В° 3.5В° 7В° 0В° 3.5В° 7В° Оё1 0В° -0В° -8В° REF Оё3 e b bbb H A-B D 0.09 L 0.45 TOP VIEW
    16.00 0.010 8В° REF 8В° REF c
    L1 ddd M C A-B s D s 1.102 BSC 0.08 4X
    aaaC A-B D
    4X 1.205 BSC R2 Оё2 8В° REF 0.15 0.20 0.004 0.006 0.008 0.60 0.75 0.018 0.024 0.030 1.30 REF 0.051 REF S 0.20 -b 0.17 0.20 0.27 0.008 -0.007 0.008 0.011 4.
    R
    00 e 0.50 BSC 0.020 BSC D2 25.50 1.004 E2 25.50 1.004 TOLERANCES OF FORM AND POSITION 16.00 E -B-0.126 0.131 0.142 D1
    E1
    -AE1 INCHES D1 aaa 0.20 0.008 bbb 0.20 0.008 ccc -0.08 -0.003 -ddd -0.08 -0.003 -NOTES:
    1. Dimensions D1 and E1 do not include mold protrusion.
    2. Dimension b does not include dambar protrusion. Allowable
    dambar protrusion shall not cause the lead width to exceed
    the maximum b dimension by more than 0.08mm. Dambar
    cannot be located on the lower radius or the foot. Minimum
    space between protrusion and an adjacent lead shall not be
    less than 0.07mm.
    3. The top package body size may be smaller than the bottom ...

Parametrics

FamilyPQFP-HS
Pin Count208
Length28.00 mm
Width28.00 mm
Thickness3.32 mm
Height max4.10 mm
Weight5.426 g
Pitch0.50 mm
Peak Temperature220 °C
Lead Free Peak Temperature260 °C
FeaturesHeat Spreader
Package IndexQ208.28X28D

Moldel Line

Series: PQFP (4)

Manufacturer's Classification

  • Plastic Packages
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