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Package Intersil Q208.28x28E

ManufacturerIntersil
SeriesPQFP
Part NumberQ208.28x28E

208 Lead Plastic Quad Flatpack Package With Exposed Pad (PQFP-EP)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    Q208.28x28E
    208 LEAD PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (PQFP-EP)
    Rev 1, 6/13
    MILLIMETERS D
    SYMBOL MIN NOM MAX MIN NOM MAX D2 A -4.10 -0.161 A1 0.25 -0.010 -A2 3.20 3.32 3.60 0.126 0.131 0.142 -D-D 30.60 BSC D1 28.00 BSC 1.102 BSC E 30.60 BSC 1.205 BSC E1
    -B-E2 28.00 BSC
    -0.25 0.003 -R1 0.08 -0.003 -q 0° 3.5° 7° 0° 3.5° 7° q1 0° -0° -8° REF q3 4X
    e b bbb H A-B D ddd M C A-B s D s TOP VIEW
    θ1 1.102 BSC 0.08 q2 4X
    aaaC A-B D 1.205 BSC R2 0.010 8° REF 8° REF 8° REF c 0.09 0.15 0.20 0.004 0.006 0.008 L 0.45 0.60 0.75 0.018 0.024 0.030 L1 1.30 REF 0.051 REF S 0.20 -0.008 -b 0.17 0.20 0.27 0.007 0.008 0.011 e 0.50 BSC 0.020 BSC D2 25.50 1.004 E2 25.50 1.004 TOLERANCES OF FORM AND POSITION
    θ -C-SEATING
    PLANE
    ccc C
    -0.05 S A1 SIDE VIEW A A2 c
    L1 aaa 0.20 bbb 0.20 0.008
    0.008 ccc -0.08 -0.003 -ddd -0.08 -0.003 -NOTES:
    1. Dimensions D1 and E1 do not include mold protrusion.
    2. Dimension b does not include dambar protrusion. Allowable dambar
    protrusion shall not cause the lead width to exceed the maximum b
    dimension by more than 0.08mm. Dambar cannot be located on the
    lower radius or the foot. Minimum space between protrusion and an
    adjacent lead shall not be less than 0.07mm. ...

Parametrics

FamilyPQFP-HS
Pin Count208
Length28.00 mm
Width28.00 mm
Thickness3.32 mm
Height max4.10 mm
Weight6.7498 g
Pitch0.50 mm
Peak Temperature220 °C
Lead Free Peak Temperature260 °C
FeaturesHeat Spreader
Package IndexQ208.28X28E

Moldel Line

Series: PQFP (4)

Manufacturer's Classification

  • Plastic Packages
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