8 Lead Quad Flat No-Lead Plastic Package Package Outline Drawing (POD)- Download », PDF, 1.7 Mb
Docket ↓Plastic Packages for Integrated Circuits Package Outline Drawing
L8.3x3
8 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 3/07
3.00 4X 0.65 A
B 6
PIN #1 INDEX AREA 8 7 6
PIN 1
INDEX AREA
1 5 2 3.00 6 (4X) 1 .10 В± 0 . 15 0.15
4 3 0.10 M C A B
4 8X 0.28 В± 0.05 TOP VIEW
8X 0.60 В± 0.15 BOTTOM VIEW
SEE DETAIL "X" 0.10 C 0 . 90 В± 0.1
( 4X 0 . 65 ) ( 2. 60 TYP ) C BASE PLANE
SEATING PLANE
0.08 C ( 1. 10 ) SIDE VIEW ( 8X 0 . 28 ) C 0 . 2 REF 5 0 . 00 MIN.
0 . 05 MAX. ( 8X 0 . 80) TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal В± 0.05
4. Dimension b applies to the metallized terminal and is measured ...
Parametrics| Family | QFN |
|---|
| Pin Count | 8 |
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| Length | 3.00 mm |
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| Width | 3.00 mm |
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| Thickness | 0.90 mm |
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| Height max | 1.00 mm |
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| Weight | 0.022 g |
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| Pitch | 0.65 mm |
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| Peak Temperature | 240 °C |
|---|
| Lead Free Peak Temperature | 260 °C |
|---|
| Package Index | L8.3X3 |
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Moldel LineSeries: QFN (100 from 124) Manufacturer's Classification |
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