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Package Intersil L24.4x4F

Package Intersil L24.4x4F

ManufacturerIntersil
SeriesTQFN
Part NumberL24.4x4F

24 Lead Thin Quad Flat No-lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L24.4X4F
    24 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 2, 1/11
    2.50
    4.00 20X 0.50 A
    B 19 6
    PIN 1
    INDEX AREA 18 4.00
    (4X) 24
    1 EXP. DAP
    2.50 В±0.05 SQ. 2.50 6 13 0.15 0.10 M C A B TOP VIEW 12 4 24X 0.250 В±0.050 6
    PIN #1
    INDEX AREA 7 0.25 MIN (4 SIDES) 24X 0.400 В±0.10
    BOTTOM VIEW SEE DETAIL "X"
    ( 3.80 )
    ( 2.50) 0.10 C 0.75 В±0.05 SEATING PLANE
    0.08 C
    SIDE VIEW ( 20X 0.50) ( 3.80 )
    ( 2.50 ) (24X 0.25) C 0 . 2 REF 5 0 . 00 MIN.
    0 . 05 MAX. ( 24 X 0.60)
    TYPICAL RECOMMENDED LAND PATTERN DETAIL "X"
    NOTES: ...

Parametrics

FamilyTQFN
Pin Count24
Length4.00 mm
Width4.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.04 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL24.4X4F

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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