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Package Intersil L32.5x5C

Package Intersil L32.5x5C

ManufacturerIntersil
SeriesTQFN
Part NumberL32.5x5C

32 Lead Thin Quad Flat No-lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L32.5x5C
    32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 0, 09/08
    3.50
    5.00 28X 0.50 A
    B 6 6
    PIN 1
    INDEX AREA 24 1 3.50 5.00 3.10
    Exp. DAP 8 17
    (4X) PIN #1 INDEX AREA 32 25 0.15 32X 0.25 4
    0.10 M C A B 9 16
    3.10
    Exp. DAP SIDE VIEW TOP VIEW 32X 0.40 BOTTOM VIEW SEE DETAIL "X"
    ( 4.80 )
    ( 3.50)
    0.10 C Max 0.80
    ( 28X 0.50) C SEATING PLANE
    0.08 C SIDE VIEW
    ( 4.80 )
    ( 3.10 sq)
    ( 3.50) (32X .25) C 0 . 2 REF 5 0 . 00 MIN.
    0 . 05 MAX. ( 32 X 0.60) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: ...

Parametrics

FamilyTQFN
Pin Count32
Length5.00 mm
Width5.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.068 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL32.5X5C

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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