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Package Intersil L38.5x7C

Package Intersil L38.5x7C

ManufacturerIntersil
SeriesTQFN
Part NumberL38.5x7C

38 Lead Thin Quad Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L38.5x7C
    38 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 0, 3/12
    38x 0.40 В±0.05
    5.00 3.50 A 6 EXP PAD B 6
    PIN 1
    INDEX AREA 7.00 PIN 1
    INDEX AREA (2X) 5.50 5.50
    EXP PAD 0.10
    TOP VIEW 0.10 M C A B
    38x 0.25 В±0.05
    4 34x 0.50 BSC
    (38X 0.60) 3.00 (3.50) BOTTOM VIEW
    SEE DETAIL "X"
    MAX 0.80
    0.10 C
    C
    SEATING PLANE
    0.05 C (5.50) (38X 0.25) SIDE VIEW
    (6.80) 5
    C (34x 0.50) (0.20) 0.00 -0.05
    DETAIL "X" (3.00) ...

Parametrics

FamilyTQFN
Pin Count38
Width5.00 mm
Thickness0.80 mm
Height max0.80 mm
Weight0.11 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL38.5X7C

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages
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