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Package Intersil L40.5x5D

Package Intersil L40.5x5D

ManufacturerIntersil
SeriesTQFN
Part NumberL40.5x5D

40 Lead Thin Quad Flat No-lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L40.5x5D 40 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    Rev 0, 9/10
    4X 3.60
    5.00 36X 0.40 A B 6
    PIN #1 INDEX AREA 5.00 3.65 6
    PIN 1
    INDEX AREA (4X) 0.15
    40X 0.4В± 0.1 TOP VIEW b BOTTOM VIEW 0.20 0.10 M C A B 4 PACKAGE OUTLINE
    0.40
    SEE DETAIL "X" 0.750 // 0.10 C
    C
    BASE PLANE
    SEATING PLANE
    0.08 C 0.050 3.65 5.00 SIDE VIEW (36X 0.40) (40X 0.20) 5 C 0.2 REF (40X 0.60) 0.00 MIN
    0.05 MAX TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension b applies to the metallized terminal and is measured
    between 0.15mm and 0.27mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be
    located within the zone indicated. The pin #1 identifier may be 7. JEDEC reference drawing: MO-220WHHE-1 either a mold or mark feature. 1 ...

Parametrics

FamilyTQFN
Pin Count40
Length5.00 mm
Width5.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.065 g
Pitch0.40 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL40.5X5D

Moldel Line

Series: TQFN (40)

Manufacturer's Classification

  • Plastic Packages

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