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Package Intersil Q64.10x10D

Package Intersil Q64.10x10D

ManufacturerIntersil
SeriesTQFP
Part NumberQ64.10x10D

64 Lead Thin Plastic Quad Flatpack Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    Q64.10x10D
    64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
    Rev 3, 11/16
    12.00 4 5
    10.00 D 3 3 A
    10.00 4 5 12.00
    B 0.50 3 4X 0.20 C A-B D
    TOP VIEW 11/13В° 4X 0.20 H A-B D BOTTOM VIEW 1.20 MAX 0.05 / / 0.10 C SIDE VIEW 0В° MIN. 0.08 C SEE DETAIL "A" 2 H
    1.00 В±0.05 7 0.08 M C A-B D
    WITH LEAD FINISH 0.22 В±0.05 0.05/0.15 0.08
    R. MIN.
    0.20 MIN. 0.09/0.20 0.60 В±0.15 0.09/0.16 0.20 В±0.03 0-7В° 0.25 GAUGE
    PLANE DETAIL "A"
    SCALE: NONE BASE METAL (1.00) NOTES: (10.00)
    (0.28) TYP 1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
    2. Datum plane H located at mold parting line and coincident
    with lead, where lead exits plastic body at bottom of parting line.
    3. Datums A-B and D to be determined at centerline between
    leads where leads exit plastic body at datum plane H.
    4. Dimensions do not include mold protrusion. Allowable mold
    protrusion is 0.254mm. 10.00 5. These dimensions to be determined at datum plane H.
    6. Package top dimensions are smaller than bottom dimensions ...

Parametrics

FamilyTQFP
Pin Count64
Thickness1.00 mm
Height max1.20 mm
Weight0.345 g
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexQ64.10X10D

Moldel Line

Series: TQFP (16)

Manufacturer's Classification

  • Plastic Packages
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