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Package Intersil L6.1.6x1.6C

Package Intersil L6.1.6x1.6C

ManufacturerIntersil
SeriesuTDFN
Part NumberL6.1.6x1.6C

6 LEAD ULTRA THIN DUAL FLAT NO-LEAD COL PLASTIC PACKAGE (UTDFN COL)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L6.1.6x1.6C
    6 LEAD ULTRA THIN DUAL FLAT NO-LEAD COL PLASTIC PACKAGE (UTDFN COL)
    Rev 1, 05/15
    1.60 6
    PIN 1
    INDEX AREA 1X0. 60 В± 0. 1 A 1.60 B 4X 0.50
    2X 1.00 (4X) 0.15
    4 0. 25 В± 0. 05 / -0.07 0.10M C A B 5X 0. 50 В± 0. 1 TOP VIEW
    BOTTOM VIEW
    (1X 0.80)
    (5X 0.70) (6X 0.25) SEE DETAIL "X"
    0.10 C 0.55 MAX C BASE PLANE
    SIDE VIEW SEATING PLANE
    0.08 C (4X .050) C 0 . 2 REF 5 0 . 00 MIN.
    0 . 05 MAX. 2.00 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1 1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension b applies to the metallized terminal and is measured
    between 0.20mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may
    be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be
    located within the zone indicated. The pin #1 identifier may be
    either a mold or mark feature. ...

Parametrics

FamilyuTDFN
Pin Count6
Length1.60 mm
Width1.60 mm
Weight0.0052 g
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL6.1.6X1.6C

Moldel Line

Series: uTDFN (7)

Manufacturer's Classification

  • Plastic Packages
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