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Package Intersil L8.2x2

Package Intersil L8.2x2

ManufacturerIntersil
SeriesuTDFN
Part NumberL8.2x2

8 Lead Ultra Thin Dual Flat No-Lead COL Plastic Package (UTDFN COL)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.2x2
    8 Lead Ultra Thin Dual Flat No-Lead COL Plastic Package (UTDFN COL)
    Rev 4, 05/15
    2X 1.5 2.00 A 6
    PIN 1
    INDEX AREA PIN #1 INDEX AREA
    6
    B 6X 0.50
    1 4
    7X 0.4 В± 0.1 1X 0.5 В±0.1 2.00 (4X) 0.15
    8 5 0.10 M C A B TOP VIEW 4 0.25 +0.05 / -0.07
    BOTTOM VIEW ( 8X 0 . 25 )
    SEE DETAIL "X"
    ( 1X 0 .70 )
    0 . 55 MAX 0.10 C C BASE PLANE
    SEATING PLANE
    0.08 C (1.8 ) SIDE VIEW C ( 7X 0 . 60 ) 0 . 2 REF 5 0 . 00 MIN.
    0 . 05 MAX.
    ( 6X 0 . 5 ) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES:
    1. 1 Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension b applies to the metallized terminal and is measured
    between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may ...

Parametrics

FamilyuTDFN
Pin Count8
Length2.00 mm
Width2.00 mm
Height max0.55 mm
Weight0.0062 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.2X2

Moldel Line

Series: uTDFN (7)

Manufacturer's Classification

  • Plastic Packages
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