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Package Intersil L8.2x3C

Package Intersil L8.2x3C

ManufacturerIntersil
SeriesuTDFN
Part NumberL8.2x3C

8 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 0.5mm THICK (UTDFN)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L8.2x3C
    8 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 0.5mm THICK (UTDFN)
    Rev 1, 04/16
    0.10 M C A B
    8X
    0.25 В±0.05
    0.50 BSC 0.50 В±0.05 B 0.30 В±0.10 4 5 PIN 1 INDEX AREA
    3.00 В±0.05 1.30 В±0.10 5 PIN 1 INDEX AREA
    A 1.50 В±0.10 0.0 -0.05 2.00 В±0.05 BOTTOM VIEW TOP VIEW DETAIL A 0.05 C (6 x 0.50 BSC) PACKAGE OUTLINE 8X (8 x 0.25) 0.127 REF. 0.05 C
    C 0.127 + 0.058
    -0.008
    TERMINAL THICKNESS 4 0.127 В±0.008
    (1.30) 0.0 -0.05
    DETAIL A (8 x 0.20)
    (8 x 0.50)
    (1.50)
    TYPICAL RECOMMENDED LAND PATTERN NOTES:
    1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance: Decimal В±0.05 4. Dimension applies to the metallized terminal and is measured
    between 0.018mm and 0.30mm from the terminal tip. 5. The configuration of the pin #1 identifier is optional, but must be
    located within the zone indicated. The pin #1 identifier may be
    either a mold or mark feature. 1 ...

Parametrics

FamilyuTDFN
Pin Count8
Length2.00 mm
Width3.00 mm
Thickness0.50 mm
Height max0.55 mm
Weight0.022 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL8.2X3C

Moldel Line

Series: uTDFN (7)

Manufacturer's Classification

  • Plastic Packages
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