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Package Intersil L16.2.6x1.8A

Package Intersil L16.2.6x1.8A

ManufacturerIntersil
SeriesuTQFN
Part NumberL16.2.6x1.8A

16 Lead Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN COL)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
    D L16.2.6x1.8A B 16 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
    MILLIMETERS 6
    INDEX AREA
    2X A N SYMBOL E 0.10 C
    1 2
    2X MIN NOMINAL MAX NOTES A 0.45 0.50 0.55 -A1 -0.05 -0.10 C A3
    TOP VIEW 0.10 C C A 0.05 C 0.127 REF -b 0.15 0.20 0.25 5 D 2.55 2.60 2.65 -E 1.75 1.80 1.85 -e 0.40 BSC -SEATING PLANE
    A1
    SIDE VIEW K 0.15 -L 0.35 0.40 0.45 -L1 0.45 0.50 0.55 -N 16 2 Nd 4 3 Ne 4 3 e
    PIN #1 ID K 1 2 NX L L1 Оё NX b 5
    16X
    0.10 M C A B
    0.05 M C (DATUM B)
    (DATUM A) BOTTOM VIEW 0 -12 4
    Rev. 6 1/14 NOTES:
    1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
    2. N is the number of terminals.
    3. Nd and Ne refer to the number of terminals on D and E side,
    respectively.
    4. All dimensions are in millimeters. Angles are in degrees.
    5. Dimension b applies to the metallized terminal and is measured ...

Parametrics

FamilyuTQFN
Pin Count16
Width1.80 mm
Height max0.55 mm
Weight0.0062 g
Pitch0.40 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL16.2.6X1.8A

Moldel Line

Series: uTQFN (7)

Manufacturer's Classification

  • Plastic Packages
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