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Package Intersil J8.A

ManufacturerIntersil
SeriesCLCC
Part NumberJ8.A

8 Pin 6mmx6mm Hermetic Surface Mount Package

Package Outline Drawing (POD)

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    Hermetic Packages for Integrated Circuits Package Outline Drawing
    J8.A
    8 PIN 6mmx6mm HERMETIC SURFACE MOUNT PACKAGE
    Rev 0, 3/16
    PIN #1 INDEX AREA
    6.00 В±0.13 #1 #8 #4 #5 6.00 В±0.13 TOP VIEW SIDE VIEW 1.78 В±0.20 END VIEW 1.90 В±0.08 (8x) 2.00 В±0.08 0.10 TYPICAL (REF) 1.00 TYPICAL (REF)
    #4
    #5 0.90 В±0.08 (8x) 4.20 В±0.08 (2x) 0.70 TYPICAL (REF) 1.40 В±0.08 (6x) #8 #1
    0.45 REF x45В°
    BOTTOM VIEW NOTES:
    1. The corner shape (radius, chamfer, etc.) may vary at the manufacturers option from that shown on the drawing.
    2. The package thickness dimension is the package height before being solder dipped.
    3. Dimensions are in millimeters. 1 2.9000 1.0000 0.0000 1.0000 1.4500 2.9000 Hermetic Packages for Integrated Circuits 2.5500 2.5500 2.1000 1.1500 1.1500 1.6500 1.6500 2.5500 2.5500 2.9000 0.2500
    0.0000
    0.2500 1.0000 0.2500
    0.0000
    0.2500 0.0000 1.1500 1.0000 1.6500 1.1500 2.9000 1.6500 TYPICAL RECOMMENDED LAND PATTERN 2 ...

Parametrics

FamilyCLCC
Height max0.08 inch
Length0.24 inch
Package IndexJ8.A
Pin Count8
Pitch0.06 inch
Thickness0.07 inch
Weight0.22 g
Width0.24 inch

Moldel Line

Series: CLCC (6)

Manufacturer's Classification

  • Hermetic Packages

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