Datasheet Microchip ATA6616C-P3QW-1
| Manufacturer | Microchip |
| Series | ATA6616C |
| Part Number | ATA6616C-P3QW-1 |
The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks
Datasheets
ATA6616C/ATA6617C - Complete Datasheet
PDF, 8.5 Mb, File published: Jan 1, 2015
Extract from the document
Status
| Lifecycle Status | Production (Appropriate for new designs but newer alternatives may exist) |
Packaging
| Package | VQFN |
| Pins | 38 |
Parametrics
| Description | LIN System-in-Package (SiP) Solution |
| LIN Specification Supported | 1.3, 2.0, 2.1, 2.2, SAE J2602-2 |
| Max. Baud Rate | 20 KBaud |
| Vcc Range | 5 - 27 V |
| Vreg Output Current | 85 mA |
| Vreg Output Voltage | 5.0 V |
Eco Plan
| RoHS | Compliant |
Other Options
Model Line
Series: ATA6616C (1)
- ATA6616C-P3QW-1
Manufacturer's Classification
- Interface and Connectivity > LIN > LIN System-in-Package Solution
Other Names:
ATA6616CP3QW1, ATA6616C P3QW 1