Datasheet Texas Instruments TPS65149RSHR

Manufacturer	Texas Instruments
Series	TPS65149
Part Number	TPS65149RSHR

LCD Bias Solution For LCD Panels Using ASG/GIP Technology 56-VQFN -40 to 85

Datasheets

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PDF, 223 Kb, File published: Aug 19, 2010

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To request a full data sheet, please send an email to:
display_contact@list.ti.com SLVSAC1 September 2010 PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 PACKAGING INFORMATION
Orderable Device Status
(1) TPS65149RSHR ACTIVE Package Type Package Pins Package
Drawing
Qty
VQFN RSH 56 2500 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Op Temp (В°C) Device Marking
(4/5) -40 to 85 TPS
65149 (1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan -The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) -please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight …

Prices

Status

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	Yes

Packaging

Pin	56
Package Type	RSH
Industry STD Term	VQFN
JEDEC Code	S-PQFP-N
Package QTY	2500
Carrier	LARGE T&R
Width (mm)	7
Length (mm)	7
Thickness (mm)	0.9
Pitch (mm)	0.4
Max Height (mm)	1
Mechanical Data	Download

Parametrics

DisplayType	LCD Unipolar
IC Integration	LCD Bias,LCD Level shifter,VCOM
Level Shifter/Scan Driver	8 Ch
Pin/Package	56VQFN
Source Driver Voltage(Max)	18 V
Source Driver Voltage(Min)	7 V
Special Function	I2C I/F,Level Shifter,Output Discharge,Reset Generator,Temperature Sensor/Compensation,VCOM/OpAmp
Target Application	13 to 21 inches,21 inches and above
Topology	Boost
Vin(Max)	6 V
Vin(Min)	3 V

Eco Plan

RoHS

Compliant

Application Notes

Download
Understanding Undervoltage Lockout in Power Devices (Rev. A)
PDF, 90 Kb, Revision: A, File published: Sep 19, 2018
Many integrated circuits include an undervoltage lockout (UVLO) function to disable the device at low supply voltages. Below the minimum supply voltage the function and performance of a device may be undefined making it impossible to predict system behavior. This application note explains how to correctly understand the undervoltage lockout specification in the data sheets of TI's power products.
Download
Minimizing Ringing at the Switch Node of a Boost Converter
PDF, 201 Kb, File published: Sep 15, 2006
The application report explains how to use proper board layout and/or a snubber to reduce high-frequency ringing at the switch node of a boost converter.

Model Line

Series: TPS65149 (1)

TPS65149RSHR

Manufacturer's Classification

Semiconductors > Power Management > LCD/OLED Display Bias Solutions