Datasheet Analog Devices ADPA7002

GaAs, pHEMT, MMIC, 1/2 W,
18 GHz to 44 GHz, Power Amplifier
ADPA7002 Data Sheet FUNCTIONAL BLOCK DIAGRAM
GND RFOUT GND VDET 15 14 13 12 ADPA7002
VREF Output P1dB: 28 dBm (typical at 34 GHz to 44 GHz)
PSAT: 29.5 dBm (typical at 24 GHz to 34 GHz)
Gain: 15 dB (typical at 34 GHz to 44 GHz)
IP3: 38 dBm (typical)
Integrated power detector
Supply voltage: 5 V at 700 mA
16-terminal, 6 mm × 6 mm, ceramic, high frequency, air
cavity package 16 FEATURES VDD3 1 11 VDD4 VDD1 2 10 VDD2 VGG1 3 9 VGG1 5 6 7 8 GND RFIN GND NIC PACKAGE
BASE
GND 20071-001 4 Military
Test instrumentation
Communications NIC APPLICATIONS Figure 1. GENERAL DESCRIPTION
The ADPA7002 is a gallium arsenide (GaAs), pseudomorphic
high electron mobility transfer (pHEMT), monolithic microwave
integrated circuit (MMIC), 28 dBm (1/2 W) power amplifier, with
an integrated temperature compensated on-chip power detector
that operates between 18 GHz and 44 GHz. The ADPA7002
provides 15 dB of small signal gain and 30 dBm of saturated
output power (PSAT) at 32 GHz from a 5 V supply. With an IP3 of …

GaAs, pHEMT, MMIC,1/2 W,
20 GHz to 44 GHz, Power Amplifier
ADPA7002CHIP Data Sheet
FEATURES FUNCTIONAL BLOCK DIAGRAM Output P1dB: 28 dBm (typical at 34 GHz to 44 GHz)
PSAT: 30 dBm (typical at 20 GHz to 34 GHz)
Gain: 15 dB (typical at 34 GHz to 44 GHz)
IP3: 40 dBm (typical)
Supply voltage: 5 V at 600 mA
Die size: 2.75 mm × 1.805 mm × 0.1 mm VGG1A VDD1A VDD3A VDD2A VREF ADPA7002CHIP
RFIN RFOUT Military and space
Test instrumentation VGG1B VDD1B VDD2B VDD3B VDET 17236-001 GND APPLICATIONS Figure 1. GENERAL DESCRIPTION
The ADPA7002CHIP is a gallium arsenide (GaAs), monolithic
microwave integrated circuit (MMIC), pseudomorphic high
electron mobility transistor (pHEMT), distributed power
amplifier that operates from 20 GHz to 44 GHz. The amplifier
provides 15 dB of small signal gain, 28 dBm output power at
1 dB gain compression (P1dB), and a typical output third-order
intercept (IP3) of 40 dBm. The amplifier requires 600 mA from Rev. C a 5 V supply on VDD1B, VDD2B, and VDD3B. The ADPA7002CHIP
also features inputs/outputs (I/Os) that are internally matched to
50 Ω, and facilitates integration into multichip modules (MCMs).
All data is taken with the on substrate chip connected via two
wire bonds that are 0.025 mm (1 mil) wide and 0.31 mm (12 mils)
long. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no …