Datasheet AD8017 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Low Cost, High Output Current, High Output Voltage Line Driver |
| Pages / Page | 17 / 5 — AD8017. ABSOLUTE MAXIMUM RATINGS1. 2.0. Watts – 1.5. TJ = 150. 1.0. TJ = … |
| Revision | C |
| File Format / Size | PDF / 262 Kb |
| Document Language | English |
AD8017. ABSOLUTE MAXIMUM RATINGS1. 2.0. Watts – 1.5. TJ = 150. 1.0. TJ = 125. 0.5. MAXIMUM POWER DISSIPATION. AMBIENT TEMPERATURE –
Text Version of Document
AD8017 ABSOLUTE MAXIMUM RATINGS1
The output stage of the AD8017 is designed for maximum load Supply Voltage . 13.2 V current capability. As a result, shorting the output to common Internal Power Dissipation2 can cause the AD8017 to source or sink 500 mA. To ensure Small Outline Package (R) . 1.3 W proper operation, it is necessary to observe the maximum power Input Voltage (Common Mode) . ± VS derating curves. Direct connection of the output to either power Differential Input Voltage . ± 2.5 V supply rail can destroy the device. Output Short Circuit Duration . Observe Power Derating Curves
2.0
Storage Temperature Range . –65°C to +125°C Operating Temperature Range . –40°C to +85°C Lead Temperature Range (Soldering 10 sec) . 300°C
Watts – 1.5
NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma-
TJ = 150
ⴗ
C
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational
1.0
section of this specification is not implied. Exposure to absolute maximum rating
TJ = 125
ⴗ
C
conditions for extended periods may affect device reliability. 2Specification is for device on a two-layer board with 2500 mm2 of 2 oz. copper at +25°C 8-lead SOIC package: θ
0.5
JA = 95.0°C/W.
MAXIMUM POWER DISSIPATION MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8017
0
is limited by the associated rise in junction temperature. The
0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE –
ⴗ
C
maximum safe junction temperature for plastic encapsulated device is determined by the glass transition temperature of the Figure 3. Plot of Maximum Power Dissipation vs. plastic, approximately 150°C. Temporarily exceeding this limit Temperature for AD8017 may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junc- tion temperature of 175°C for an extended period can result in device failure.
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8017AR –40°C to +85°C 8-Lead SOIC SO-8 AD8017AR-REEL –40°C to +85°C Tape and Reel 13" SO-8 AD8017AR-REEL7 –40°C to +85°C Tape and Reel 7" SO-8 AD8017AR-EVAL Evaluation Board
619
⍀
619
⍀
619
⍀
619
⍀
VOUT VIN VOUT RL 54.4 R
⍀
L VIN +VS 49.9
⍀
+V + S 0.1
F 10
F + 0.1
F 10
F + 0.1
F 10
F + 0.1
F 10
F –VS –VS
Figure 4. Test Circuit: Gain = +2 Figure 5. Test Circuit: Gain = –1
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD8017 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
ESD SENSITIVE DEVICE
precautions are recommended to avoid performance degradation or loss of functionality. –4– REV. C
The output stage of the AD8017 is designed for maximum load Supply Voltage . 13.2 V current capability. As a result, shorting the output to common Internal Power Dissipation2 can cause the AD8017 to source or sink 500 mA. To ensure Small Outline Package (R) . 1.3 W proper operation, it is necessary to observe the maximum power Input Voltage (Common Mode) . ± VS derating curves. Direct connection of the output to either power Differential Input Voltage . ± 2.5 V supply rail can destroy the device. Output Short Circuit Duration . Observe Power Derating Curves
2.0
Storage Temperature Range . –65°C to +125°C Operating Temperature Range . –40°C to +85°C Lead Temperature Range (Soldering 10 sec) . 300°C
Watts – 1.5
NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma-
TJ = 150
ⴗ
C
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational
1.0
section of this specification is not implied. Exposure to absolute maximum rating
TJ = 125
ⴗ
C
conditions for extended periods may affect device reliability. 2Specification is for device on a two-layer board with 2500 mm2 of 2 oz. copper at +25°C 8-lead SOIC package: θ
0.5
JA = 95.0°C/W.
MAXIMUM POWER DISSIPATION MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8017
0
is limited by the associated rise in junction temperature. The
0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE –
ⴗ
C
maximum safe junction temperature for plastic encapsulated device is determined by the glass transition temperature of the Figure 3. Plot of Maximum Power Dissipation vs. plastic, approximately 150°C. Temporarily exceeding this limit Temperature for AD8017 may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junc- tion temperature of 175°C for an extended period can result in device failure.
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8017AR –40°C to +85°C 8-Lead SOIC SO-8 AD8017AR-REEL –40°C to +85°C Tape and Reel 13" SO-8 AD8017AR-REEL7 –40°C to +85°C Tape and Reel 7" SO-8 AD8017AR-EVAL Evaluation Board
619
⍀
619
⍀
619
⍀
619
⍀
VOUT VIN VOUT RL 54.4 R
⍀
L VIN +VS 49.9
⍀
+V + S 0.1
F 10
F + 0.1
F 10
F + 0.1
F 10
F + 0.1
F 10
F –VS –VS
Figure 4. Test Circuit: Gain = +2 Figure 5. Test Circuit: Gain = –1
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD8017 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
ESD SENSITIVE DEVICE
precautions are recommended to avoid performance degradation or loss of functionality. –4– REV. C
