Datasheet MCP3422, MCP3423, MCP3424 (Microchip) - 5

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MCP3422/3/4 1.0 ELECTRICAL †Notice:
Stresses above those listed under “Maximum Rat-
CHARACTERISTICS
ings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
Absolute Maximum Ratings†
operational listings of this specification is not implied. V Exposure to maximum rating conditions for extended periods DD...7.0V may affect device reliability. All inputs and outputs ... ..VSS –0.4V to VDD+0.4V Differential Input Voltage .. |VDD - VSS| Output Short Circuit Current .. Continuous Current at Input Pins ..±2 mA Current at Output and Supply Pins ..±10 mA Storage Temperature ..-65°C to +150°C Ambient Temp. with power applied ...-55°C to +125°C ESD protection on all pins .. ≥ 6 kV HBM, ≥ 400V MM Maximum Junction Temperature (TJ). ...+150°C
ELECTRICAL CHARACTERISTICS Electrical Specifications:
Unless otherwise specified, all parameters apply for TA = -40°C to +85°C, VDD = +5.0V, VSS = 0V, CHn+ = CHn- = VREF/2, VINCOM = VREF /2. All ppm units use 2*VREF as differential full scale range.
Parameters Sym Min Typ Max Units Conditions Analog Inputs
Differential Full Scale Input FSR — ±2.048/PGA — V VIN = [CHn+ - CHn-] Voltage Range Maximum Input Voltage Range VSS-0.3 — VDD+0.3 V
(Note 1)
Differential Input Impedance ZIND (f) — 2.25/PGA — MΩ During normal mode operation
(Note 2)
Common Mode input ZINC (f) — 25 — MΩ PGA = 1, 2, 4, 8 Impedance
System Performance
Resolution and No Missing 12 — — Bits DR = 240 SPS Codes

14 — — Bits DR = 60 SPS (Effective Number of Bits) 16 — — Bits DR = 15 SPS
(Note 3)
18 — — Bits DR = 3.75 SPS Data Rate DR 176 240 328 SPS 12 bits mode
(Note 4)
44 60 82 SPS 14 bits mode 11 15 20.5 SPS 16 bits mode 2.75 3.75 5.1 SPS 18 bits mode Output Noise — 1.5 — µVRMS TA = +25°C, DR = 3.75 SPS, PGA = 1, VIN+ = VIN- = GND Integral Non-Linearity INL — 10 35 ppm of DR = 3.75 SPS, FSR = Full FSR Scale Range
(Note 5)
Internal Reference Voltage VREF — 2.048 — V Gain Error
(Note 6 )
— 0.05 0.35 % PGA = 1, DR = 3.75 SPS
Note 1:
Any input voltage below or greater than this voltage causes leakage current through the ESD diodes at the input pins. This parameter is ensured by characterization and not 100% tested.
2:
This input impedance is due to 3.2 pF internal input sampling capacitor.
3:
This parameter is ensured by design and not 100% tested.
4:
The total conversion speed includes auto-calibration of offset and gain.
5:
INL is the difference between the endpoints line and the measured code at the center of the quantization band.
6:
Includes all errors from on-board PGA and VREF.
7:
This parameter is ensured by characterization and not 100% tested.
8:
MCP3423 and MCP3424 only.
9:
Addr_Float voltage is applied at address pin.
10:
No voltage is applied at address pin (left “floating”). © 2009 Microchip Technology Inc. DS22088C-page 5 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: INL vs. Supply Voltage (VDD). FIGURE 2-2: INL vs. Temperature. FIGURE 2-3: Offset Error vs. Temperature. FIGURE 2-4: Output Noise vs. Input Voltage. FIGURE 2-5: Total Error vs. Input Voltage. FIGURE 2-6: Gain Error vs. Temperature. FIGURE 2-7: IDDA vs. Temperature. FIGURE 2-8: IDDS vs. Temperature. FIGURE 2-9: IDDB vs. Temperature. FIGURE 2-10: Oscillator Drift vs. Temperature. FIGURE 2-11: Frequency Response. 3.0 Pin Descriptions TABLE 3-1: PIN Function Table 3.1 Analog Inputs (CHn+, CHn-) 3.2 Supply Voltage (VDD, VSS) FIGURE 3-1: Equivalent Analog Input Circuit. 3.3 Serial Clock Pin (SCL) 3.4 Serial Data Pin (SDA) 3.5 Exposed Thermal Pad (EP) 4.0 Description of Device Operation 4.1 General Overview 4.2 Power-On-Reset (POR) FIGURE 4-1: POR Operation. 4.3 Internal Voltage Reference 4.4 Analog Input Channels 4.5 Input Voltage Range 4.6 Input Impedance 4.7 Aliasing and Anti-aliasing Filter 4.8 Self-Calibration 4.9 Digital Output Codes and Conversion to Real Values TABLE 4-1: Resolution Settings VS. LSB TABLE 4-2: Example of output code for 18 bits (Note 1, Note 2) TABLE 4-3: Minimum and Maximum Output codes (Note) TABLE 4-4: Example of converting output code to voltage (With 18 Bit Setting) 5.0 Using the Devices 5.1 Operating Modes 5.2 Configuration Register TABLE 5-1: Write Configuration Bits TABLE 5-2: READ Configuration Bits 5.3 I2C Serial Communications FIGURE 5-1: Address Byte. FIGURE 5-2: General Call Latch Command and Voltage Output at Address Pin Left “Floating” (MCP3423 and MCP3424). FIGURE 5-3: Timing Diagram For Writing To The MCP3422/3/4. TABLE 5-3: Output Codes of each Resolution OPTION FIGURE 5-4: Timing Diagram For Reading From The MCP3422/3/4 With 18-Bit Mode. FIGURE 5-5: Timing Diagram For Reading From The MCP3422/3/4 With 12-Bit to 16-Bit Modes. 5.4 General Call FIGURE 5-6: General Call Address Format. 5.5 High-Speed (HS) Mode 5.6 I2C Bus Characteristics FIGURE 5-7: Data Transfer Sequence on I2C Serial Bus. TABLE 5-4: I2c serial timing Specifications (Continued) FIGURE 5-8: I2C Bus Timing Data. 6.0 Basic Application Configuration 6.1 Connecting to the Application Circuits FIGURE 6-1: Typical Connection. FIGURE 6-2: Example of Multiple Device Connection on I2C Bus. FIGURE 6-3: I2C Bus Connection Test. FIGURE 6-4: Differential and Single- Ended Input Connections. 6.2 Application Examples FIGURE 6-5: Battery Voltage and Charging/Discharging Current Measurement. FIGURE 6-6: Four-Channel Thermocouple Applications. FIGURE 6-7: Example of Pressure and Temperature Measurement. 7.0 Development Tool Support 7.1 MCP3422/3/4 Evaluation Boards FIGURE 7-1: MCP3424 Evaluation Board. FIGURE 7-2: Setup for the MCP3424 Evaluation Board with PICkit™ Serial Analyzer. FIGURE 7-3: Example of PICkit™ Serial User Interface. 8.0 Packaging Information 8.1 Package Marking Information