Datasheet AD8608-KGD (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | Low Noise, CMOS, Rail-to-Rail, Input/Output Precision Quad Op Amp |
| Pages / Page | 7 / 7 — Known Good Die. AD8608-KGD. OUTLINE DIMENSIONS. 0.305. 1.900. 2.930. 11B. … |
| File Format / Size | PDF / 170 Kb |
| Document Language | English |
Known Good Die. AD8608-KGD. OUTLINE DIMENSIONS. 0.305. 1.900. 2.930. 11B. 11A. NC 8. TOP VIEW. SIDE VIEW. (CIRCUIT SIDE). 0.092 × 0.092. 2015-. 13-
Model Line for this Datasheet
Text Version of Document
Known Good Die AD8608-KGD OUTLINE DIMENSIONS 0.305 1.900 1 14 2 13 3 12 4A 2.930 11B 4B 11A 5 10 6 9 7 NC 8 NC TOP VIEW A SIDE VIEW (CIRCUIT SIDE) 0.092 × 0.092 2015- 13- 04-
Figure 2. 14-Pad Bare Die [CHIP] (C-14-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Die Size (Maximum) 1900 × 2930 µm Bond Pad Composition AlCu (0.5%) % Bond Pad (Minimum) 92 × 92 µm Passivation Type OxyNitride Not applicable Thickness 305 µm Backside Bias GND Not applicable Scribe Line (Street) Width 100 × 150 µm ESD HBM 4000 V
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 84-1LMIS R4 Bonding Method 1 mil gold
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8608-KGD-CHIP −40°C to +125°C 14-Pad Bare Die [CHIP] C-14-3
©2015 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13166-0-4/15(0)
Rev. 0 | Page 7 of 7 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 5 V ELECTRICAL SPECIFICATIONS 2.7 V ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 2. 14-Pad Bare Die [CHIP] (C-14-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Die Size (Maximum) 1900 × 2930 µm Bond Pad Composition AlCu (0.5%) % Bond Pad (Minimum) 92 × 92 µm Passivation Type OxyNitride Not applicable Thickness 305 µm Backside Bias GND Not applicable Scribe Line (Street) Width 100 × 150 µm ESD HBM 4000 V
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 84-1LMIS R4 Bonding Method 1 mil gold
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8608-KGD-CHIP −40°C to +125°C 14-Pad Bare Die [CHIP] C-14-3
©2015 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13166-0-4/15(0)
Rev. 0 | Page 7 of 7 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 5 V ELECTRICAL SPECIFICATIONS 2.7 V ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
