Datasheet LTM8002 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 40VIN, 2.5A Silent Switcher µModule Regulator |
| Pages / Page | 28 / 2 — ABSOLUTE MAXIMUM RATINGS (Notes 1, 2). PIN CONFIGURATION. ORDER … |
| File Format / Size | PDF / 2.4 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS (Notes 1, 2). PIN CONFIGURATION. ORDER INFORMATION http://www.linear.com/product/LTM8002#orderinfo
Model Line for this Datasheet
Text Version of Document
LTM8002
ABSOLUTE MAXIMUM RATINGS (Notes 1, 2)
V Maximum Internal Temperature (I-Grade) ... 125°C IN, RUN, PG Voltage .. 42V V Maximum Internal Temperature (H-Grade) ... 150°C OUT, BIAS Voltage ... 19V FB, TR/SS Voltage ... 4V Storage Temperature (I-Grade) ... –55°C to 125°C SYNC Voltage .. 6V Storage Temperature (H-Grade) ... –55°C to 150°C Peak Reflow Solder Body Temperature ... 260°C
PIN CONFIGURATION
TOP VIEW TOP VIEW ADJUSTABLE VERSION FIXED OUTPUT VERSION SYNC TR/SS GND SYNC TR/SS GND A RT A RT PG RUN PG RUN B B NC VIN NC VIN C C GND GND D NC D NC FB BANK 1 BANK 1 E E BIAS GND BIAS GND F F BANK 2 BANK 2 VOUT VOUT G G 1 2 3 4 5 6 7 1 2 3 4 5 6 7 BGA PACKAGE BGA PACKAGE 49-LEAD (6.25mm × 6.25mm × 2.22mm) BGA PACKAGE 49-LEAD (6.25mm × 6.25mm × 2.22mm) BGA PACKAGE TJMAX = 150°C, θJA = 21.1°C/W, θJCbottom = 5.9°C/W TJMAX = 150°C, θJA = 21.1°C/W, θJCbottom = 5.9°C/W θJCtop = 24.4°C/W, θJB = 4.4°C/W, WEIGHT = 0.5g θJCtop = 24.4°C/W, θJB = 4.4°C/W, WEIGHT = 0.5g θ VALUES DETERMINED PER JEDEC51-9, 51-12 θ VALUES DETERMINED PER JEDEC51-9, 51-12
ORDER INFORMATION http://www.linear.com/product/LTM8002#orderinfo PART MARKING* PACKAGE MSL PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM8002IY#PBF SAC305 (RoHS) LTM8002 e1 BGA 3 –40°C to 125°C LTM8002HY#PBF SAC305 (RoHS) LTM8002 e1 BGA 3 –40°C to 150°C LTM8002HY SnPb (63/37) LTM8002 e0 BGA 3 –40°C to 150°C LTM8002IY-3.3#PBF SAC305 (RoHS) LTM8002-3.3 e1 BGA 3 –40°C to 125°C LTM8002HY-3.3#PBF SAC305 (RoHS) LTM8002-3.3 e1 BGA 3 –40°C to 150°C • Consult Marketing for parts specified with wider operating temperature • Recommended BGA PCB Assembly and Manufacturing Procedures: ranges. *Device temperature grade is indicated by a label on the shipping www.linear.com/umodule/pcbassembly container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • BGA Package and Tray Drawings: www.linear.com/packaging • Terminal Finish Part Marking: www.linear.com/leadfree Rev 0 2 For more information www.analog.com Document Outline FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION ORDER INFORMATION ELECTRICAL CHARACTERISTICS TYPICAL PERFORMANCE CHARACTERISTICS PIN FUNCTIONS BLOCK DIAGRAM OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATIONS PACKAGE PHOTO PACKAGE DESCRIPTION PACKAGE DESCRIPTION TYPICAL APPLICATION DESIGN RESOURCES RELATED PARTS
ABSOLUTE MAXIMUM RATINGS (Notes 1, 2)
V Maximum Internal Temperature (I-Grade) ... 125°C IN, RUN, PG Voltage .. 42V V Maximum Internal Temperature (H-Grade) ... 150°C OUT, BIAS Voltage ... 19V FB, TR/SS Voltage ... 4V Storage Temperature (I-Grade) ... –55°C to 125°C SYNC Voltage .. 6V Storage Temperature (H-Grade) ... –55°C to 150°C Peak Reflow Solder Body Temperature ... 260°C
PIN CONFIGURATION
TOP VIEW TOP VIEW ADJUSTABLE VERSION FIXED OUTPUT VERSION SYNC TR/SS GND SYNC TR/SS GND A RT A RT PG RUN PG RUN B B NC VIN NC VIN C C GND GND D NC D NC FB BANK 1 BANK 1 E E BIAS GND BIAS GND F F BANK 2 BANK 2 VOUT VOUT G G 1 2 3 4 5 6 7 1 2 3 4 5 6 7 BGA PACKAGE BGA PACKAGE 49-LEAD (6.25mm × 6.25mm × 2.22mm) BGA PACKAGE 49-LEAD (6.25mm × 6.25mm × 2.22mm) BGA PACKAGE TJMAX = 150°C, θJA = 21.1°C/W, θJCbottom = 5.9°C/W TJMAX = 150°C, θJA = 21.1°C/W, θJCbottom = 5.9°C/W θJCtop = 24.4°C/W, θJB = 4.4°C/W, WEIGHT = 0.5g θJCtop = 24.4°C/W, θJB = 4.4°C/W, WEIGHT = 0.5g θ VALUES DETERMINED PER JEDEC51-9, 51-12 θ VALUES DETERMINED PER JEDEC51-9, 51-12
ORDER INFORMATION http://www.linear.com/product/LTM8002#orderinfo PART MARKING* PACKAGE MSL PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM8002IY#PBF SAC305 (RoHS) LTM8002 e1 BGA 3 –40°C to 125°C LTM8002HY#PBF SAC305 (RoHS) LTM8002 e1 BGA 3 –40°C to 150°C LTM8002HY SnPb (63/37) LTM8002 e0 BGA 3 –40°C to 150°C LTM8002IY-3.3#PBF SAC305 (RoHS) LTM8002-3.3 e1 BGA 3 –40°C to 125°C LTM8002HY-3.3#PBF SAC305 (RoHS) LTM8002-3.3 e1 BGA 3 –40°C to 150°C • Consult Marketing for parts specified with wider operating temperature • Recommended BGA PCB Assembly and Manufacturing Procedures: ranges. *Device temperature grade is indicated by a label on the shipping www.linear.com/umodule/pcbassembly container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • BGA Package and Tray Drawings: www.linear.com/packaging • Terminal Finish Part Marking: www.linear.com/leadfree Rev 0 2 For more information www.analog.com Document Outline FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION ORDER INFORMATION ELECTRICAL CHARACTERISTICS TYPICAL PERFORMANCE CHARACTERISTICS PIN FUNCTIONS BLOCK DIAGRAM OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATIONS PACKAGE PHOTO PACKAGE DESCRIPTION PACKAGE DESCRIPTION TYPICAL APPLICATION DESIGN RESOURCES RELATED PARTS
